Vogelwaid, J.; Bayer, M.; Walz, M.; Hampel, F.; Kutuzova, L.; Lorenz, G.; Kandelbauer, A.; Jacob, T.
Optimizing Epoxy Molding Compound Processing: A Multi-Sensor Approach to Enhance Material Characterization and Process Reliability. Polymers 2024, 16, 1540.
https://doi.org/10.3390/polym16111540
AMA Style
Vogelwaid J, Bayer M, Walz M, Hampel F, Kutuzova L, Lorenz G, Kandelbauer A, Jacob T.
Optimizing Epoxy Molding Compound Processing: A Multi-Sensor Approach to Enhance Material Characterization and Process Reliability. Polymers. 2024; 16(11):1540.
https://doi.org/10.3390/polym16111540
Chicago/Turabian Style
Vogelwaid, Julian, Martin Bayer, Michael Walz, Felix Hampel, Larysa Kutuzova, Günter Lorenz, Andreas Kandelbauer, and Timo Jacob.
2024. "Optimizing Epoxy Molding Compound Processing: A Multi-Sensor Approach to Enhance Material Characterization and Process Reliability" Polymers 16, no. 11: 1540.
https://doi.org/10.3390/polym16111540
APA Style
Vogelwaid, J., Bayer, M., Walz, M., Hampel, F., Kutuzova, L., Lorenz, G., Kandelbauer, A., & Jacob, T.
(2024). Optimizing Epoxy Molding Compound Processing: A Multi-Sensor Approach to Enhance Material Characterization and Process Reliability. Polymers, 16(11), 1540.
https://doi.org/10.3390/polym16111540
