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Journal: MicromachinesVolume: 14Number: 1491
Article: Advancements in SiC-Reinforced Metal Matrix Composites for High-Performance Electronic Packaging: A Review of Thermo-Mechanical Properties and Future Trends
  • Authors:
  • Liyan Lai1,*,
  • Bing Niu1 and
  • Yuxiao Bi1
  • et al.
Link: https://www.mdpi.com/2072-666X/14/8/1491

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