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Open AccessArticle

Design and Experiment of a Solder Paste Jetting System Driven by a Piezoelectric Stack

School of Mechanical Science and Engineering, Jilin University, No. 5988, Renmin Road, Changchun 130025, China
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Author to whom correspondence should be addressed.
Academic Editor: Joost Lötters
Micromachines 2016, 7(7), 112; https://doi.org/10.3390/mi7070112
Received: 8 May 2016 / Revised: 26 June 2016 / Accepted: 28 June 2016 / Published: 30 June 2016
To compensate for the insufficiency and instability of solder paste dispensing and printing that are used in the SMT (Surface Mount Technology) production process, a noncontact solder paste jetting system driven by a piezoelectric stack based on the principle of the nozzle-needle-system is introduced in this paper, in which a miniscule gap exists between the nozzle and needle during the jetting process. Here, the critical jet ejection velocity is discussed through theoretical analysis. The relations between ejection velocity and needle structure, needle velocity, and nozzle diameter were obtained by FLUENT software. Then, the prototype of the solder paste jetting system was fabricated, and the performance was verified by experiments. The effects of the gap between nozzle and needle, the driving voltage, and the nozzle diameter on the jetting performance and droplet diameter were obtained. Solder paste droplets 0.85 mm in diameter were produced when the gap between the nozzle and needle was adjusted to 10 μm, the driving voltage to 80 V, the nozzle diameter to 0.1 mm, and the variation of the droplet diameter was within ±3%. View Full-Text
Keywords: solder paste; jetting; piezoelectric; ejection behavior solder paste; jetting; piezoelectric; ejection behavior
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MDPI and ACS Style

Gu, S.; Jiao, X.; Liu, J.; Yang, Z.; Jiang, H.; Lv, Q. Design and Experiment of a Solder Paste Jetting System Driven by a Piezoelectric Stack. Micromachines 2016, 7, 112.

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