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Journal: Materials, 2026
Volume: 19
Number: 2188
2188
Article: Fabrication and Bonding Strength of Sn-Decorated MWCNT-Reinforced Sn-3.0Ag-0.5Cu Composite Solder Joints: Reflow vs. IPL Soldering
Authors: by DongGil Kang, HoGyeong Seong, JaeJun Yoon, MinJae Sung, JinHo Joo, JeongWon Yoon and SeungBoo Jung
Link: https://www.mdpi.com/1996-1944/19/11/2188

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