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Journal: Materials, 2025
Volume: 18
Number: 3722

Article: Effects of Electromigration on Sn-Bi Lead-Free Solder Alloy Joints on Copper and Copper with Nickel Surface Finish
Authors: by Lohgaindran Jeyeselan and Ervina Efzan Mhd Noor
Link: https://www.mdpi.com/1996-1944/18/16/3722

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