Peng, C.; Zhai, Y.; Chen, X.; Wang, C.; Hong, Y.; Chen, Y.; He, W.; Zhou, G.; Liu, B.
Structure Performance Correlation of N-Heterocyclic Oligomer Leveler for Acid Copper Plating of Advanced Interconnects. Molecules 2023, 28, 2783.
https://doi.org/10.3390/molecules28062783
AMA Style
Peng C, Zhai Y, Chen X, Wang C, Hong Y, Chen Y, He W, Zhou G, Liu B.
Structure Performance Correlation of N-Heterocyclic Oligomer Leveler for Acid Copper Plating of Advanced Interconnects. Molecules. 2023; 28(6):2783.
https://doi.org/10.3390/molecules28062783
Chicago/Turabian Style
Peng, Chuan, Yuehui Zhai, Xianming Chen, Chong Wang, Yan Hong, Yuanming Chen, Wei He, Guoyun Zhou, and Binyun Liu.
2023. "Structure Performance Correlation of N-Heterocyclic Oligomer Leveler for Acid Copper Plating of Advanced Interconnects" Molecules 28, no. 6: 2783.
https://doi.org/10.3390/molecules28062783
APA Style
Peng, C., Zhai, Y., Chen, X., Wang, C., Hong, Y., Chen, Y., He, W., Zhou, G., & Liu, B.
(2023). Structure Performance Correlation of N-Heterocyclic Oligomer Leveler for Acid Copper Plating of Advanced Interconnects. Molecules, 28(6), 2783.
https://doi.org/10.3390/molecules28062783