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For the first two volumes of this new journal the APC are of 300 CHF (or 550 CHF per paper for those papers that require extensive additional formatting and/or English corrections). http://www.mdpi.com/1996-1944/3/3/1573/ Ti1-xAlxN coated tools are commonly used in high-speed machining, where the cutting edge of an end-mill or insert is exposed to temperatures up to 1100 °C. Here, we investigate the effect of Yttrium addition on the thermal stability of Ti1-xAlxN coatings. Reactive DC magnetron sputtering of powder metallurgically prepared Ti0.50Al0.50, Ti0.49Al0.49Y0.02, and Ti0.46Al0.46Y0.08 targets result in the formation of single-phase cubic (c) Ti0.45Al0.55N, binary cubic/wurtzite c/w-Ti0.41Al0.57Y0.02N and singe-phase w-Ti0.38Al0.54Y0.08N coatings. Using pulsed DC reactive magnetron sputtering for the Ti0.49Al0.49Y0.02 target allows preparing single-phase c-Ti0.46Al0.52Y0.02N coatings. By employing thermal analyses in combination with X-ray diffraction and transmission electron microscopy investigations of as deposited and annealed (in He atmosphere) samples, we revealed that Y effectively retards the decomposition of the Ti1-x-yAlxYyN solid-solution to higher temperatures and promotes the precipitation of c-TiN, c-YN, and w-AlN. Due to their different microstructure and morphology already in the as deposited state, the hardness of the coatings decreases from ~35 to 22 GPa with increasing Y-content and increasing wurtzite phase fraction. Highest peak hardness of ~38 GPa is obtained for the Y-free c-Ti0.45Al0.55N coating after annealing at Ta = 950 °C, due to spinodal decomposition. After annealing above 1000 °C the highest hardness is obtained for the 2 mol % YN containing c-Ti0.46Al0.52Y0.02N coating with ~29 and 28 GPa for Ta = 1150 and 1200 °C, respectively. http://www.mdpi.com/1996-1944/3/3/1573/ Thu, 04 Mar 2010 00:00:00 CET Materials 2010-03-04 3 3 Article 1573 1592 1996-1944 Influence of Yttrium on the Thermal Stability of Ti-Al-N Thin Films 2010-03-04 doi: 10.3390/ma3031573 Martin Moser Daniel Kiener Christina Scheu Paul H. Mayrhofer http://www.mdpi.com/1996-1944/3/2/1203/ Honeycomb monoliths consist of a large number of parallel channels that provide high contact efficiencies between the monolith and gas flow streams. These structures are used as adsorbents or supports for catalysts when large gas volumes are treated, because they offer very low pressure drop, short diffusion lengths and no obstruction by particulate matter. Carbon-based honeycomb monoliths can be integral or carbon-coated ceramic monoliths, and they take advantage of the versatility of the surface area, pore texture and surface chemistry of carbon materials. Here, we review the preparation methods of these monoliths, their characteristics and environmental applications. http://www.mdpi.com/1996-1944/3/2/1203/ Fri, 19 Feb 2010 00:00:00 CET Materials 2010-02-19 3 2 Review 1203 1227 1996-1944 Carbon-Based Honeycomb Monoliths for Environmental Gas-Phase Applications 2010-02-19 doi: 10.3390/ma3021203 Carlos Moreno-Castilla Agustín F. Pérez-Cadenas http://www.mdpi.com/1996-1944/2/4/1796/ In this paper we will demonstrate how a thermodynamic-kinetic method can be utilized to rationalize a wide range of interfacial phenomena between Sn-based lead-free solders and Ni metallizations. First, the effect of P on the interfacial reactions, and thus on the reliability, between Sn-based solders and electroless Ni/immersion Au (ENIG) metallizations, will be discussed. Next, the effect of small amounts of Cu in Sn-based solders on the intermetallic compound (IMC), which forms first on top of Ni metallization, will be covered. With the help of thermodynamic arguments a so called critical Cu concentration for the formation of (Cu,Ni)6Sn5 can be determined as a function of temperature. Then the important phenomenon of redeposition of (Au,Ni)Sn4 layer on top of Ni3Sn4 IMC will be discussed in detail. The reasons leading to this behaviour will be rationalized with the help of thermodynamic information and an explanation of why this phenomenon does not occur when an appropriate amount of Cu is present in the soldering system will be given. Finally, interfacial reaction issues related to low temperature Sn-Zn and Sn-Bi based solders and Ni metallization will be discussed. http://www.mdpi.com/1996-1944/2/4/1796/ Wed, 11 Nov 2009 00:00:00 CET Materials 2009-11-11 2 4 Review 1796 1834 1996-1944 Combined Thermodynamic-Kinetic Analysis of the Interfacial Reactions between Ni Metallization and Various Lead-Free Solders 2009-11-11 doi: 10.3390/ma2041796 Tomi Laurila Vesa Vuorinen