Special Issue "Tactile Sensing for Soft Robotics and Wearables"
A special issue of Micromachines (ISSN 2072-666X).
Deadline for manuscript submissions: closed (30 April 2018)
Dr. Lucia Beccai
In recent years, rapid developments in tactile sensing have mainly been due to the advent of novel deformable materials, mimicking skin flexibility and elasticity. In addition to single sensors, electronic skins built from both inorganic and organic electronic materials have boosted up, especially ultra-thin and ultra-conformable systems. However, many aspects require new concepts at component, as well as at system, levels. For example, effective solutions for achieving multimodality are needed. Indeed, information of various types (e.g., pressure, temperature, humidity, etc.) should be detected in a robust and reliable manner, and in large area issues of real-time signal processing are posed, as well of wiring and connections. Additionally, today, new challenges emerge from soft robotic approaches and wearable systems, where the use of deformable sensors becomes crucial for encoding a variety of information that are not only provided by the external world, but also by the deformation of the hosting robot/human body. This Special Issue seeks to showcase research papers, short communications, and review articles on novel developments of soft tactile sensing, and mechanical sensing more at large. The focus is on new designs and models, new materials and fabrication processes, advanced signal processing and innovative machine learning algorithms that could be useful to target real applications in both in robotics and wearable systems, e.g., biomimetic skins, smart surgical tools, wearables for monitoring vital parameters (e.g., body temperature, blood pulse) and body movements.
Dr. Lucia Beccai
Dr. Massimo Totaro
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1200 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- Artificial touch
- Soft robotics
- Mechanical sensors
- Wearable systems
- Soft materials
- Machine learning