Special Issue "Polymer MEMS"

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A special issue of Micromachines (ISSN 2072-666X).

Deadline for manuscript submissions: closed (30 December 2011)

Special Issue Editor

Guest Editor
Prof. Dr. Elisabeth Smela
Dept. of Mechanical Engineering, University of Maryland, 2176 Glenn L. Martin Hall, College Park, MD 20742 , USA
Website: http://www.smela.umd.edu
E-Mail: smela@umd.edu
Phone: +1 301-405-5265
Fax: +1 301-314-9477

Special Issue Information

Dear Colleagues,

Polymer MEMS is a fast-expanding field with wide-ranging applications, from lab-on-a-chip systems to new actuators to flexible devices. Polymer MEMS have generated excitement because they offer novel and improved functionality, as well as lower cost. This special issue seeks to capture recent developments as well as shape future directions. Our goals are to showcase interesting, high-quality research, to encourage and enable wider use of polymeric materials by the microsystems community, to advance understanding of the challenges and opportunities in the field, and to inspire new approaches and ideas.
In view of the recent advances in this exciting field, Micromachines will publish a special issue dedicated to polymer MEMS. We invite papers in all areas of polymer MEMS, including but not limited to the following topics.  Papers may be original contributions or reviews, and they may be experimental or theoretical.
  • Sensors and Actuators

    - mechanical (strain, pressure, etc.)
    - chemical and electrochemical
    - optical
    - thermal
  • Electroactive and smart materials

    - piezoelectrics
    - shape memory polymers
    - gels, conjugated polymers
    - nanocomposites
    - biomaterials
  • Microfluidics

    - technologies for cell culture, cell analysis, drug testing
    - systems for proteomics, metabolomics, genomics, etc.
    - components, including microvalves, pumps
    - sample preparation
  • Integration

    - integration with circuitry
    - integration with Si MEMS
    - packaging
    - biocompatibility
  • Fabrication

    - printing (ink jet, screen), rapid prototyping
    - molding, embossing, roll-to-roll processing
    - etching, laser machining
    - electrochemical deposition
    - UV-crosslinking, surface modification
  • Novel form factors

    - flexible, stretchable, foldable systems
    - large-area systems
    - 3D microsystems, spheres, tubes, fibers

Dr. Elisabeth Smela
Guest Editor

Submission

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. Papers will be published continuously (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are refereed through a peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed Open Access quarterly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. For the first couple of issues the Article Processing Charge (APC) will be waived for well-prepared manuscripts. English correction and/or formatting fees of 250 CHF (Swiss Francs) will be charged in certain cases for those articles accepted for publication that require extensive additional formatting and/or English corrections.

Keywords

  • microelectromechanical systems (MEMS)
  • microfabrication
  • sensor
  • actuator
  • microfluidics
  • lab on a chip
  • micro total analysis systems (MicroTAS)
  • packaging
  • integration
  • SU8
  • parylene
  • polyimide
  • smart material
  • electroactive material
  • composite

Published Papers (8 papers)

Open Access
Micromachines 2011, 2(2), 157-166; doi:10.3390/mi2020157
Received: 31 March 2011; in revised form: 3 May 2011 / Accepted: 9 May 2011 / Published: 11 May 2011
Show/Hide Abstract | Download PDF Full-text (282 KB)

Open Access
Micromachines 2011, 2(3), 356-368; doi:10.3390/mi2030356
Received: 1 August 2011; in revised form: 28 August 2011 / Accepted: 29 August 2011 / Published: 8 September 2011
Show/Hide Abstract | Download PDF Full-text (3147 KB)

Open Access
Micromachines 2011, 2(4), 431-442; doi:10.3390/mi2040431
Received: 7 November 2011; in revised form: 28 November 2011 / Accepted: 7 December 2011 / Published: 13 December 2011
Show/Hide Abstract | Download PDF Full-text (2863 KB)

Open Access
Micromachines 2012, 3(1), 62-77; doi:10.3390/mi3010062
Received: 20 December 2011; in revised form: 20 January 2012 / Accepted: 7 February 2012 / Published: 15 February 2012
Show/Hide Abstract | Download PDF Full-text (410 KB)

Open Access
Micromachines 2012, 3(1), 137-149; doi:10.3390/mi3010137
Received: 1 February 2012; in revised form: 2 March 2012 / Accepted: 2 March 2012 / Published: 13 March 2012
Show/Hide Abstract | Download PDF Full-text (3603 KB)

Open Access
Micromachines 2012, 3(2), 270-278; doi:10.3390/mi3020270
Received: 15 February 2012; in revised form: 14 March 2012 / Accepted: 16 March 2012 / Published: 28 March 2012
Show/Hide Abstract | Download PDF Full-text (2905 KB)

Open Access
Micromachines 2012, 3(2), 315-324; doi:10.3390/mi3020315
Received: 11 February 2012; in revised form: 5 March 2012 / Accepted: 13 March 2012 / Published: 10 April 2012
Show/Hide Abstract | Download PDF Full-text (588 KB)

Open Access
Micromachines 2012, 3(2), 427-441; doi:10.3390/mi3020427
Received: 10 March 2012; in revised form: 26 April 2012 / Accepted: 26 April 2012 / Published: 4 May 2012
Show/Hide Abstract | Download PDF Full-text (954 KB) | View HTML Full-text | Download PMC-XML Full-text

Last update: 17 February 2012

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