Special Issue "Thin-Film Deposition, Characterization and Advanced Surface Engineering"
A special issue of Materials (ISSN 1996-1944).
Deadline for manuscript submissions: closed (31 October 2016)
Dr. Lanxia Cheng
Department of Materials Science and Engineering, University of Texas at Dallas, Richardson, TX 75080, USA
Interests: materials chemistry; nanotechnology; surface chemistry
Deposition of surface and interface engineered thin films with well-tailored properties has been a field of intense research in both academia and prospective technology. Such thin film deposition technology, including atomic layer deposition, enables the scaling down of complementary metal-oxide-semiconductor (CMOS) technology to nodes smaller than 10 nm. The key topic and scope of this forthcoming Special Issue is dedicated to presenting our readers with a diverse overview of the recent advances and developments in thin film growth and characterization, surface and interface treatment methods, and characterization of the chemical, physical, and electrical properties of nanostructured functional materials.
- Advanced thin film process, characterization and simulation for electronic devices, sensors, and energy applications
- Fabrication, surface modification, characterization, and simulation of nanostructured materials, such as 2D (e.g. graphene and transition metal dichalcogenides), 1D (e.g., nanotubes and nanowires), and 0D (e.g., quantum dots and nanoparticles)
- Fabrication, surface treatment, characterization, integration, and applications of alternative channel materials, such as III-V and 2D materials
- Organic and inorganic multifunctional nanomaterials: Synthesis, properties, characterization
- Applications of thin films and surface engineering
We are looking forward to your submissions to this Special Issue regarding, but not limited to, the above topics in the form of either a full-length research manuscript or short communication. Please contact us if you have any questions regarding this Special Issue.
Dr. Jiyoung Kim
Dr. Lanxia Cheng
Manuscript Submission Information
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