Special Issue "Advances in Bendable and Soft Material Film"
Deadline for manuscript submissions: closed (31 August 2016)
The dream of building easy processing, low cost, low temperature manufacturing, low energy consumption, lightweight, fast, conformal and rugged devices, which serve for bendable electronic field or soft wound dressing biomaterial field is becoming more and more feasible with regards to the incredible advances made in drug carrier and flexible transistor in past few years. Advances in bendable and soft material film inspire versatile new fields, such as regenerative medicine, tissue engineering and drug delivery, as well as flexible display, radio frequency identification tag, and organic thin film transistor.
It is my pleasure to invite you to submit original research papers within the scope of this Special Issue. Short communication and state-of-the-art reviews will also be greatly appreciated.
Prof. Dr. Fu-Hsiang Ko
Prof. Dr. Jian-Guo Zheng
Prof. Dr. Chih-Feng Wang
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- bendable material
- soft matter
- flexible devices and electronics
- wound dressing material
- wearable sensor material
- soft transduction medium or structure
- sol-gel material
- soft hydrated and porous materials