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Selected Papers from IS3C2016

A special issue of Materials (ISSN 1996-1944).

Deadline for manuscript submissions: closed (15 October 2016) | Viewed by 9392

Special Issue Editors

1. Department of Mechanical Engineering, National Chung Cheng University, Chiayi 621301, Taiwan
2. Advanced Institute of Manufacturing with High-tech Innovations, National Chung Cheng University, Chiayi 621301, Taiwan
Interests: non-linear system analysis and control; robust control; electrical and mechanical system control; signal processing; communication security and confidentiality control
Special Issues, Collections and Topics in MDPI journals
Department of Electronic Engineering, National Chin-Yi University of Technology
Interests: optical communication component design; optical fiber sensor design; plasmon sensor and physics; nano sensor

Special Issue Information

Dear Colleagues,

The International Symposium on Computer, Consumer and Control 2016 (IS3C) will be held in Xi'an, China, from 4 to 6 July, 2016. It is formally Technically Co-Sponsored by the IEEE Computer Society and the IEEE Industrial Electronics Society. This conference offers a great opportunity for scientists, engineers, and practitioners to present the latest research results, ideas, developments, and applications. Original high-quality papers related to advanced multimedia, computer, telecommunication, sensors and semiconductor, consumer electronics, renewable energy, systems and control, and digital signal processing are especially solicited, including theories, methodologies, and applications. All accepted papers will be published in the conference proceedings and submitted to the IEEE Xplore database as well as the EI index. This Special Issue selects excellent papers from IS3C2016 and covers a very broad scope. We invite investigators to contribute original research articles, as well as review articles, to this Special Issue.

Prof. Dr. Hsiung-Cheng Lin
Prof. Dr. Her-Terng Yau
Assoc. Prof. Dr. Yue-Jing He
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.


Keywords

  • advanced multimedia
  • computer
  • telecommunication
  • sensors and semiconductor
  • consumer electronics
  • renewable energy, systems and control
  • digital signal processing
  • IS3C; Taiwan

Published Papers (2 papers)

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Research

2108 KiB  
Article
Recording Characteristics, Microstructure, and Crystallization Kinetics of Ge/GeCu Recording Film Used for Write-Once Blu-Ray Disc
by Sin-Liang Ou, Feng-Min Lai, Wei-Kai Wang, Shih-Yung Huang, An-Cheng Sun, Ching-Ho Tien, Zhi-Jia Xu, Chin-Yen Yeh and Kuo-Sheng Kao
Materials 2016, 9(11), 953; https://doi.org/10.3390/ma9110953 - 23 Nov 2016
Viewed by 3898
Abstract
A Ge67Cu33 (16 nm) layer and a Ge (3 nm)/Ge67Cu33 (16 nm) bilayer were grown by sputtering at room temperature and used as the recording films for write-once blue laser media. In comparison to the crystallization temperature [...] Read more.
A Ge67Cu33 (16 nm) layer and a Ge (3 nm)/Ge67Cu33 (16 nm) bilayer were grown by sputtering at room temperature and used as the recording films for write-once blue laser media. In comparison to the crystallization temperature of Ge in a GeCu film (380.7 °C–405.1 °C), the crystallization temperature of Ge in a Ge/GeCu bilayer could be further decreased to 333.7 °C–382.8 °C. The activation energies of Ge crystallization were 3.51 eV ± 0.05 eV and 1.50 eV ± 0.04 eV for the GeCu and the Ge/GeCu films, respectively, indicating that the Ge/GeCu bilayer possesses a higher feasibility in high-speed optical recording applications. Moreover, the lower activation energy would lead to a larger grain size of Ge crystallization in the Ge/GeCu bilayer after the annealing process. Between the as-deposited and the annealed states, the optical contrasts (@ 405 nm) of the GeCu and the Ge/GeCu films were 26.0% and 47.5%, respectively. This reveals that the Ge/GeCu bilayer is more suitable for the recording film of a write-once blu-ray disc (BD-R) in comparison with the GeCu film. Based on the dynamic tests performed for 2× and 4× recording speeds, the optimum jitter values of the BD-R with the Ge/GeCu recording film were 7.4% at 6.3 mW and 7.6% at 8.6 mW, respectively. Full article
(This article belongs to the Special Issue Selected Papers from IS3C2016)
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6061 KiB  
Article
Improvement in Fatigue Performance of Aluminium Alloy Welded Joints by Laser Shock Peening in a Dynamic Strain Aging Temperature Regime
by Chun Su, Jianzhong Zhou, Xiankai Meng and Shu Huang
Materials 2016, 9(10), 799; https://doi.org/10.3390/ma9100799 - 26 Sep 2016
Cited by 18 | Viewed by 5157
Abstract
As a new treatment process after welding, the process parameters of laser shock peening (LSP) in dynamic strain aging (DSA) temperature regimes can be precisely controlled, and the process is a non-contact one. The effects of LSP at elevated temperatures on the distribution [...] Read more.
As a new treatment process after welding, the process parameters of laser shock peening (LSP) in dynamic strain aging (DSA) temperature regimes can be precisely controlled, and the process is a non-contact one. The effects of LSP at elevated temperatures on the distribution of the surface residual stress of AA6061-T6 welded joints were investigated by using X-ray diffraction technology with the sin2ϕ method and Abaqus software. The fatigue life of the welded joints was estimated by performing tensile fatigue tests. The microstructural evolution in surface and fatigue fractures of the welded joints was presented by means of surface integrity and fracture surface testing. In the DSA temperature regime of AA6061-T6 welded joints, the residual compressive stress was distributed more stably than that of LSP at room temperature. The thermal corrosion resistance and fatigue properties of the welded joints were also improved. The experimental results and numerical analysis were in mutual agreement. Full article
(This article belongs to the Special Issue Selected Papers from IS3C2016)
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