Special Issue "Wetting on Micro/Nano-Scale: From Fundamentals to Application"

A special issue of Colloids and Interfaces (ISSN 2504-5377).

Deadline for manuscript submissions: 30 November 2018

Special Issue Editors

Guest Editor
Assoc. Prof. David A. Beattie

Future Industries Institute, University of South Australia, Adelaide, Australia
Website | E-Mail
Interests: polymer adsorption; colloidal interactions; wetting/dewetting; flotation; aqueous lubrication; polyelectrolyte multilayers; vibrational spectroscopy; ionic liquids at interfaces; precursor films
Guest Editor
Dr. Nan Gao

Future Industries Institute, University of South Australia, Adelaide, Australia
Website | E-Mail
Interests: wetting; surface forces; interfacial dynamics; nanomaterials; colloids and functional surfaces
Guest Editor
Prof. Dr. Victor Starov

Chemical Engineering Department, Loughborough University, Loughborough, UK
Website | E-Mail
Interests: Colloid and Interface Science, kinetics of wetting and spreading

Special Issue Information

Dear Colleagues,

Wetting refers to the study of how a liquid deposited on a solid (or liquid) substrate spreads out, with dewetting being the reverse process (the retraction of a liquid over a solid). It is a process that underpins many industries, from mineral processing to personal care and cosmetics. Although wetting phenomena are evident on the macroscopic scale (such as seeing water droplets slide off superhydrophobic plant leaves), the quantitative study of wetting is best performed with consideration of processes and characteristics on very small length scales. Very often, the dynamics of wetting are critically influenced by micro- and nano-structures on surfaces, and by molecular processes occurring at the various interfaces. Furthermore, the study of small (sub-micron) droplets and bubbles on surfaces is also a distinct area of wetting that has much room for further knowledge generation. The goal of this Special Issue is to encourage the submission of articles on wetting and dewetting phenomena that focus on nanoscale aspects of the process (nanostructures, molecular processes, small bubbles and droplets, precursor films). Also, submissions that have a strong connection to the consequences of wetting (and dewetting) in applications that result from nano-scale variations and properties are encouraged.

Assoc. Prof. David A. Beattie
Dr. Nan Gao
Prof. Dr. Victor Starov
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Colloids and Interfaces is an international peer-reviewed open access quarterly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) is waived for well-prepared manuscripts submitted to this issue. Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Wetting
  • Dewetting
  • Nanobubbles and nanodroplets
  • Precursor films
  • Reactive spreading
  • Pickering emulsions
  • Flotation

Published Papers

This special issue is now open for submission.
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