Special Issue "Selected Papers from Bubble & Drop 2017"
A special issue of Colloids and Interfaces (ISSN 2504-5377).
Deadline for manuscript submissions: closed (30 December 2017)
Dr. Reinhard Miller
The Bubble and Drop workshop (http://www.bd2017-lyon.fr/) is a scientific event that gathers scientists from academia and industry, working in the world of various types of interfaces, emulsion, and foams. The conference provides a podium for presenting scientific posters and oral contributions, dealing with fundamental research and industrial applications, all dealing somehow with drops and bubbles. The meeting in 2017 is organized in Lyon and is the 7th in the series.
Participants of Bubble and Drop 2017 are cordially invited to contribute original research papers to this Special Issue of Colloids and Interfaces.
Dr. Reinhard Miller
Dr. Alain Cagna
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Colloids and Interfaces is an international peer-reviewed open access quarterly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) is waived for well-prepared manuscripts submitted to this issue. Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- Bubble & drop formation, motion, interactions
- Adsorption and interfacial dynamics
- Interfacial rheology
- Foams and emulsions
- Liquid films between bubble & drop
- Wetting and spreading
- Bubble & drop in industrial applications