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J. Manuf. Mater. Process. 2018, 2(3), 58; https://doi.org/10.3390/jmmp2030058

Transient Liquid Phase Bonding of Al-6063 to Steel Alloy UNS S32304

1
Centre for Advanced Materials, Qatar University, Doha 2713, Qatar
2
Department of Materials Science and Engineering, Norwegian University of Science and Technology, 7491 Trondheim, Norway
3
School of Engineering, University of Bradford, Bradford BD7 1DP, UK
4
Hydro Research and Development Center, P.O. Box 53, 6601 Sunndalsøra, Norway
This manuscript is extension version of the conference paper: Saleh, M.I.; Khan, T.I.; Roven, H.J. Transient liquid phase bonding of AA-6063 to UNS S32304 using Cu interlayer. In Proceedings of the 5th International Conference on Recent Advances in Materials, Minerals and Environment (RAMM) & 2nd International Postgraduate Conference on Materials, Mineral and Polymer (MAMIP), Penang, Malaysia, 4–6 August 2015.
*
Author to whom correspondence should be addressed.
Received: 5 July 2018 / Revised: 16 August 2018 / Accepted: 28 August 2018 / Published: 1 September 2018
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Abstract

Transient liquid phase (TLP) bonding of 6063 aluminum alloy (Al-6063) and duplex alloy 2304 stainless steel (UNS S32304) was performed using copper foil as an interlayer between the base metals. A compression load was applied normal to the specimens. Metallurgical examination of the produced joints showed three distinct regions including a reaction zone, diffusion affected zone, and the base metals. The diffusion of copper into aluminum resulted in an Al–Cu eutectic structure. However, the oxide layer on the aluminum surface controlled the dissolution behavior of copper and the extent of its wettability with the base metals. Although voids and intermetallic compounds were detected at the interfaces of the processed joints, a defect free joint was produced at 570 °C. In addition, the results from corrosion tests showed that the use of copper as an interlayer decreased the corrosion resistance of the joints. However, increase in thickness of the joining reaction zone with increasing bonding temperature was observed to increase corrosion resistance. View Full-Text
Keywords: TLP bonding; eutectic; aluminum alloys; duplex stainless steel TLP bonding; eutectic; aluminum alloys; duplex stainless steel
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Saleh, M.I.; Roven, H.J.; Khan, T.I.; Iveland, T. Transient Liquid Phase Bonding of Al-6063 to Steel Alloy UNS S32304. J. Manuf. Mater. Process. 2018, 2, 58.

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