Passive and Chipless Packaged Sensor for the Wireless Pressure Monitoring in Harsh Environment†
AbstractA new millimetre-wave passive and chipless packaged sensor for wireless pressure monitoring in harsh environment is proposed. This sensor uses a planar microstrip resonator coupled with a high resistivity silicon membrane. The remote interrogation of this sensor is performed from a Frequency-Modulated Continuous-Wave (FMCW) radar. Prototypes have been designed and fabricated using photoresist intermediate layer for the silicon membrane bonding. Pressure characterization of packaged sensor validate the transducer and packaging hermeticity. The sensor sensitivity is close to 2% per bar for the resonant frequency and the radar response is evaluated at 2 dB per bar.
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Philippe, J.; Arenas, C.; Henry, D.; Coustou, A.; Rumeau, A.; Aubert, H.; Pons, P. Passive and Chipless Packaged Sensor for the Wireless Pressure Monitoring in Harsh Environment. Proceedings 2017, 1, 629.
Philippe J, Arenas C, Henry D, Coustou A, Rumeau A, Aubert H, Pons P. Passive and Chipless Packaged Sensor for the Wireless Pressure Monitoring in Harsh Environment. Proceedings. 2017; 1(4):629.Chicago/Turabian Style
Philippe, Julien; Arenas, Cristina; Henry, Dominique; Coustou, Anthony; Rumeau, Alexandre; Aubert, Hervé; Pons, Patrick. 2017. "Passive and Chipless Packaged Sensor for the Wireless Pressure Monitoring in Harsh Environment." Proceedings 1, no. 4: 629.
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