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Proceedings 2017, 1(4), 629; doi:10.3390/proceedings1040629

Passive and Chipless Packaged Sensor for the Wireless Pressure Monitoring in Harsh Environment

LAAS-CNRS, Université de Toulouse, CNRS, INP, Toulouse, France
Presented at the Eurosensors 2017 Conference, Paris, France, 3–6 September 2017.
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Published: 8 August 2017
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Abstract

A new millimetre-wave passive and chipless packaged sensor for wireless pressure monitoring in harsh environment is proposed. This sensor uses a planar microstrip resonator coupled with a high resistivity silicon membrane. The remote interrogation of this sensor is performed from a Frequency-Modulated Continuous-Wave (FMCW) radar. Prototypes have been designed and fabricated using photoresist intermediate layer for the silicon membrane bonding. Pressure characterization of packaged sensor validate the transducer and packaging hermeticity. The sensor sensitivity is close to 2% per bar for the resonant frequency and the radar response is evaluated at 2 dB per bar.
Keywords: passive sensor; chipless sensor; pressure sensor; radar reader passive sensor; chipless sensor; pressure sensor; radar reader
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Philippe, J.; Arenas, C.; Henry, D.; Coustou, A.; Rumeau, A.; Aubert, H.; Pons, P. Passive and Chipless Packaged Sensor for the Wireless Pressure Monitoring in Harsh Environment. Proceedings 2017, 1, 629.

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