Fabrication of Planar Copper Microcoils for Telemetric Orthodontic Applications†
AbstractThe fabrication of electroplated planar copper microcoils for telemetric orthodontic applications is presented. A set of microcoils with overall dimensions of 2 × 2.5 × 0.5 mm3, track widths down to 5 μm and turn numbers up to 35 were fabricated on glass substrates. The coils were electrically characterized and assembled via flip-chip bonding onto a stress-mapping CMOS chip for smart orthodontic brackets. The passive system was successfully read out telemetrically with a reader microcoil for a coil-coil distance of 1 mm at 13.56 MHz. The digital signal representing the measured stress values was extracted telemetrically using a commercially available RFID reader.
Scifeed alert for new publicationsNever miss any articles matching your research from any publisher
- Get alerts for new papers matching your research
- Find out the new papers from selected authors
- Updated daily for 49'000+ journals and 6000+ publishers
- Define your Scifeed now
Hafner, J.; Kuhl, M.; Schwaerzle, M.; Hehn, T.; Rossbach, D.; Paul, O. Fabrication of Planar Copper Microcoils for Telemetric Orthodontic Applications. Proceedings 2017, 1, 571.
Hafner J, Kuhl M, Schwaerzle M, Hehn T, Rossbach D, Paul O. Fabrication of Planar Copper Microcoils for Telemetric Orthodontic Applications. Proceedings. 2017; 1(4):571.Chicago/Turabian Style
Hafner, Julian; Kuhl, Matthias; Schwaerzle, Michael; Hehn, Thorsten; Rossbach, Daniel; Paul, Oliver. 2017. "Fabrication of Planar Copper Microcoils for Telemetric Orthodontic Applications." Proceedings 1, no. 4: 571.
Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.