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Proceedings 2017, 1(4), 571; doi:10.3390/proceedings1040571

Fabrication of Planar Copper Microcoils for Telemetric Orthodontic Applications

1
Laboratory for Microsystem Materials, Departement of Microsystems Engineering (IMTEK) & Cluster of Excellence Brainlinks-Brain-Tools, University of Freiburg, D-79110 Freiburg, Germany
2
Fritz-Huettinger-Chair for Microelectronics, Departement of Microsystems Engineering (IMTEK) & Cluster of Excellence Brainlinks-Brain-Tools, University of Freiburg, D-79110 Freiburg, Germany
3
Hahn-Schickard, Wilhelm-Schickard-Str. 10, 78052 Villingen-Schwenningen, Germany
Presented at the Eurosensors 2017 Conference, Paris, France, 3–6 September 2017.
*
Author to whom correspondence should be addressed.
Published: 9 August 2017
Download PDF [1008 KB, uploaded 14 August 2017]

Abstract

The fabrication of electroplated planar copper microcoils for telemetric orthodontic applications is presented. A set of microcoils with overall dimensions of 2 × 2.5 × 0.5 mm3, track widths down to 5 μm and turn numbers up to 35 were fabricated on glass substrates. The coils were electrically characterized and assembled via flip-chip bonding onto a stress-mapping CMOS chip for smart orthodontic brackets. The passive system was successfully read out telemetrically with a reader microcoil for a coil-coil distance of 1 mm at 13.56 MHz. The digital signal representing the measured stress values was extracted telemetrically using a commercially available RFID reader.
Keywords: RF microsystems; microfabrication; microcoils; electroplating; chip assembly; CMOS stress sensor RF microsystems; microfabrication; microcoils; electroplating; chip assembly; CMOS stress sensor
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Hafner, J.; Kuhl, M.; Schwaerzle, M.; Hehn, T.; Rossbach, D.; Paul, O. Fabrication of Planar Copper Microcoils for Telemetric Orthodontic Applications. Proceedings 2017, 1, 571.

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