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Proceedings 2017, 1(4), 296; doi:10.3390/proceedings1040296

Multilayer Micromechanics Process with Thick Functional Layers (EPyC40)

1
Robert Bosch GmbH, D-72762 Reutlingen, Germany
2
Department of Electrical Engineering and Information Technology and Fraunhofer Institute for Electronic Nano Systems ENAS Chemnitz, Technical University Chemnitz-Zwickau, D-09107 Chemnitz, Germany
Presented at the Eurosensors 2017 Conference, Paris, France, 3–6 September 2017.
*
Author to whom correspondence should be addressed.
Published: 17 August 2017
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Abstract

The EPyC process (Epi-Poly-Cycle) (by Robert Bosch GmbH) opens up unique opportunities for manufacturing complex 3D MEMS structures having high effectiveness in small space. EPyC40 is an EPyC process with up to 40 μm thick polysilicon layers and sacrificial silicon technique. For successful manufacturing a 40 μm EPyC the epitaxial polysilicon layer must be electrically and mechanically optimized. A vertical deep trench patterns the functional and sacrificial areas. A passivation must be deposited homogeneously and has to be tight and robust towards silicon-etching gases. For more than one cycle it is necessary to tailor the layer stress of the epitaxial polysilicon and the wafer-bow. The full process for stacking up 5 EPyC cycles with two 40 μm epitaxial polysilicon layers was investigated in detail. A true 3D MEMS device providing high z deflection by use of a vertical comb drive with 40 μm electrodes was built up successfully to prove the feasibility of the EPyC process.
Keywords: EPyC40; 3D MEMS; comb structure EPyC40; 3D MEMS; comb structure
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Louriki, L.; Staffeld, P.; Kaelberer, A.; Otto, T. Multilayer Micromechanics Process with Thick Functional Layers (EPyC40). Proceedings 2017, 1, 296.

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