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Proceedings 2017, 1(2), 46; doi:10.3390/ecsa-3-03908

Foreword: Proceedings of the 3rd International Electronic Conference on Sensors and Applications

1
Dipartimento di Ingegneria Civile e Ambientale, Politecnico di Milano, Piazza L. da Vinci 32, 20133 Milano, Italy
2
Mechanical and Aerospace Engineering & Chemical and Biomolecular Engineering, The Hong Kong University of Science and Technology Clear Water Bay Kowloon, Hong Kong, China
3
ISIS Sensorial Materials Scientific Centre, University of Bremen, 28359 Bremen, Germany
4
Research to Market Solution s.r.l., Pavia, Italy
5
Politecnico di Torino, Department of Electronics and Telecommunications, corso Duca degli Abruzzi, 24, I-10129 Torino, Italy
6
Department of Mathematics and Computer Science, University of Bremen, 28359 Bremen, Germany
Presented at the 3rd International Electronic Conference on Sensors and Applications, 15–30 November 2016; Available online: https://sciforum.net/conference/ecsa-3.
*
Authors to whom correspondence should be addressed.
Published: 31 May 2017
Download PDF [266 KB, uploaded 7 July 2017]

Abstract

This issue of Proceedings gathers the papers presented at the 3rd International Electronic Conference on Sensors and Applications (ECSA-3), held online on 15–30 November 2016 through the sciforum.net platform developed by MDPI. The annual ECSA conference was initiated in 2014 on an online basis only, to allow the participation from all over the world with no concerns of travel and related expenditures. This type of conference looks particularly appropriate and useful because research concerned with sensors is rapidly growing, and a platform for rapid and direct exchanges about the latest research findings can provide a further burst in the development of novel ideas.
Keywords: ECSA-3 editorial ECSA-3 editorial
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Mariani, S.; Ciucci, F.; Lehmhus, D.; Messervey, T.B.; Vallan, A.; Bosse, S. Foreword: Proceedings of the 3rd International Electronic Conference on Sensors and Applications. Proceedings 2017, 1, 46.

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