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Photonics 2016, 3(1), 1; doi:10.3390/photonics3010001

PLAT4M: Progressing Silicon Photonics in Europe

1
Tyndall National Institute, University College Cork, Lee Maltings, T12R5CP Cork, Ireland
2
Thales Research & Technology, 1 Avenue Augustin Fresnel, 91767 Palaiseau Cedex, France
3
Thales Optronique SA, 2 Avenue Gay Lussac, 78995 Elancourt Cedex, France
4
Department of Information Technology, Ghent University-IMEC, 9000 Ghent, Belgium
5
IMEC, 3001 Leuven, Belgium
*
Author to whom correspondence should be addressed.
Received: 16 November 2015 / Revised: 14 December 2015 / Accepted: 18 December 2015 / Published: 24 December 2015
View Full-Text   |   Download PDF [4167 KB, uploaded 24 December 2015]   |  

Abstract

Photonic integration is an appealing technology for emerging applications in communications, medical diagnostics and sensing. Silicon Photonics presents a highly attractive solution for large-scale photonic integration, principally because it is based on well-established CMOS-fabrication technologies. However, Silicon photonics can be difficult and expensive to implement, as it requires complex device design, fabrication and packaging capabilities. Photonic Libraries And Technology for Manufacturing (PLAT4M) is a major European project that brings together the key capabilities required to develop solutions for a range of Silicon photonic-based applications. This paper will present an overview of the PLAT4M project. It will present, in detail, a key application demonstrator (Coherent Beam Combiner), highlighting the ability of the project team to develop an integrated Silicon Photonic sub-system, from design, through to device fabrication, packaging and final test. The paper also highlights the need to consider additional capabilities besides device fabrication, such as packaging, which are critical to achieving fully operational sub-systems. View Full-Text
Keywords: PLATM; Si photonics; coherent beam combining; Si PIC; SOI; photonic packaging; waveguide coupling PLATM; Si photonics; coherent beam combining; Si PIC; SOI; photonic packaging; waveguide coupling
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Scarcella, C.; Lee, J.S.; Eason, C.; Antier, M.; Bourderionnet, J.; Larat, C.; Lallier, E.; Brignon, A.; Spuesens, T.; Verheyen, P.; Absil, P.; Baets, R.; O‘Brien, P.A. PLAT4M: Progressing Silicon Photonics in Europe. Photonics 2016, 3, 1.

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