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Math. Comput. Appl. 2010, 15(5), 822-827; doi:10.3390/mca15050822

Cylindrical Microparticle Transport and Deposition from Electrokinetic Microflow in a 90 Degree Bend

1
Institute of Fluid Engineering, China Jiliang University, Hangzhou, China
2
Institute of Fluid Engineering, Zhejiang University, Hangzhou, Zhejiang, China
*
Author to whom correspondence should be addressed.
Received: 31 December 2010 / Accepted: 31 December 2010 / Published: 31 December 2010
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Abstract

Cylindrical microparticle transport and deposition from electrokinetic microflow in a 90 degree bend have been numerically simulated. Under the effect of dielectrohporetic force, gravity and stokes force, it’s found that microparticles with larger size deposit on the lower region of the bend’s outer wall. An exponential curve of deposition efficiency versus the product of stokes number and shape factor is fitted based on large number of numerical results.
Keywords: Deposition Efficiency; Dielectrophoresis; Cylindrical Particle Deposition Efficiency; Dielectrophoresis; Cylindrical Particle
This is an open access article distributed under the Creative Commons Attribution License (CC BY 3.0).

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MDPI and ACS Style

Zhang, K.; Huang, L.; Nie, D. Cylindrical Microparticle Transport and Deposition from Electrokinetic Microflow in a 90 Degree Bend. Math. Comput. Appl. 2010, 15, 822-827.

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