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Mathematical and Computational Applications is published by MDPI from Volume 21 Issue 1 (2016). Articles in this Issue were published by another publisher in Open Access under a CC-BY (or CC-BY-NC-ND) licence. Articles are hosted by MDPI on mdpi.com as a courtesy and upon agreement with the previous journal publisher.
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Math. Comput. Appl. 2010, 15(5), 822-827; https://doi.org/10.3390/mca15050822

Cylindrical Microparticle Transport and Deposition from Electrokinetic Microflow in a 90 Degree Bend

1
Institute of Fluid Engineering, China Jiliang University, Hangzhou, China
2
Institute of Fluid Engineering, Zhejiang University, Hangzhou, Zhejiang, China
*
Author to whom correspondence should be addressed.
Received: 31 December 2010 / Accepted: 31 December 2010 / Published: 31 December 2010
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Abstract

Cylindrical microparticle transport and deposition from electrokinetic microflow in a 90 degree bend have been numerically simulated. Under the effect of dielectrohporetic force, gravity and stokes force, it’s found that microparticles with larger size deposit on the lower region of the bend’s outer wall. An exponential curve of deposition efficiency versus the product of stokes number and shape factor is fitted based on large number of numerical results.
Keywords: Deposition Efficiency; Dielectrophoresis; Cylindrical Particle Deposition Efficiency; Dielectrophoresis; Cylindrical Particle
This is an open access article distributed under the Creative Commons Attribution License (CC BY 3.0).
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Zhang, K.; Huang, L.; Nie, D. Cylindrical Microparticle Transport and Deposition from Electrokinetic Microflow in a 90 Degree Bend. Math. Comput. Appl. 2010, 15, 822-827.

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