Cylindrical Microparticle Transport and Deposition from Electrokinetic Microflow in a 90 Degree Bend
1
Institute of Fluid Engineering, China Jiliang University, Hangzhou, China
2
Institute of Fluid Engineering, Zhejiang University, Hangzhou, Zhejiang, China
*
Author to whom correspondence should be addressed.
Math. Comput. Appl. 2010, 15(5), 822-827; https://doi.org/10.3390/mca15050822
Submission received: 31 December 2010
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Accepted: 31 December 2010
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Published: 31 December 2010
Abstract
Cylindrical microparticle transport and deposition from electrokinetic microflow in a 90 degree bend have been numerically simulated. Under the effect of dielectrohporetic force, gravity and stokes force, it’s found that microparticles with larger size deposit on the lower region of the bend’s outer wall. An exponential curve of deposition efficiency versus the product of stokes number and shape factor is fitted based on large number of numerical results.
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MDPI and ACS Style
Zhang, K.; Huang, L.; Nie, D. Cylindrical Microparticle Transport and Deposition from Electrokinetic Microflow in a 90 Degree Bend. Math. Comput. Appl. 2010, 15, 822-827. https://doi.org/10.3390/mca15050822
AMA Style
Zhang K, Huang L, Nie D. Cylindrical Microparticle Transport and Deposition from Electrokinetic Microflow in a 90 Degree Bend. Mathematical and Computational Applications. 2010; 15(5):822-827. https://doi.org/10.3390/mca15050822
Chicago/Turabian StyleZhang, Kai, Lizhong Huang, and Deming Nie. 2010. "Cylindrical Microparticle Transport and Deposition from Electrokinetic Microflow in a 90 Degree Bend" Mathematical and Computational Applications 15, no. 5: 822-827. https://doi.org/10.3390/mca15050822
