Next Article in Journal
Random Walker Coverage Analysis for Information Dissemination in Wireless Sensor Networks
Previous Article in Journal
Oxide Thin-Film Transistors on Fibers for Smart Textiles
Article Menu

Export Article

Open AccessArticle
Technologies 2017, 5(2), 32; doi:10.3390/technologies5020032

Roll Bonding Properties of Al/Cu Bimetallic Laminates Fabricated by the Roll Bonding Technique

1
Department of Mechanical Engineering, Mobarakeh Branch, Islamic Azad University, Mobarakeh, Isfahan 8631656451, Iran
2
Department of Mechanical Engineering, Majlesi Branch, Islamic Azad University, Majlesi, Isfahan 8159716778, Iran
*
Author to whom correspondence should be addressed.
Academic Editor: Manoj Gupta
Received: 1 May 2017 / Revised: 28 May 2017 / Accepted: 29 May 2017 / Published: 8 June 2017
(This article belongs to the Section Innovations in Materials Processing)
View Full-Text   |   Download PDF [8059 KB, uploaded 9 June 2017]   |  

Abstract

Roll bonding (RB) of bimetal laminates is a solid phase method of bonding and has been widely used in the manufacturing of layered strips. This process is widely used for brazing sheet for automotive, aerospace, vessel, and electrical industries. In this study, 1-mm bimetallic aluminum 1050 and pure copper (Al/Cu) laminates were produced using the roll bonding (RB) process. The RB process was carried out with thickness reduction ratios of 10%, 20%, and 30%, separately. Particular attention was focused on the bonding of the interface between Al and Cu layers. The optimization of thickness reduction ratios was obtained for the improvement of the bond strength of bimetallic laminates during the RB process. Also, the RB method was simulated using finite element simulation in ABAQUS software. Finite Element (FE) simulation was used to model the deformation of bimetallic laminates for various thickness reduction ratios, rolling temperatures, and tensile stresses. Particular attention was focused on the rolling pressure of Al and Cu layers in the simulation. The results show that the stress distribution in the bimetal Al/Cu laminates is an asymmetrical distribution. Moreover, the bonding strength of samples was obtained using the peeling test. Also, the fracture surface of roll bonded samples around the interface of laminates after the tensile test was studied to investigate the bonding quality by scanning electron microscopy (SEM). View Full-Text
Keywords: roll bonding (RB); bond strength; bimetal laminates; peeling test; Finite Element Method (FEM) roll bonding (RB); bond strength; bimetal laminates; peeling test; Finite Element Method (FEM)
Figures

Figure 1

This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

Scifeed alert for new publications

Never miss any articles matching your research from any publisher
  • Get alerts for new papers matching your research
  • Find out the new papers from selected authors
  • Updated daily for 49'000+ journals and 6000+ publishers
  • Define your Scifeed now

SciFeed Share & Cite This Article

MDPI and ACS Style

Vini, M.H.; Daneshmand, S.; Forooghi, M. Roll Bonding Properties of Al/Cu Bimetallic Laminates Fabricated by the Roll Bonding Technique. Technologies 2017, 5, 32.

Show more citation formats Show less citations formats

Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Related Articles

Article Metrics

Article Access Statistics

1

Comments

[Return to top]
Technologies EISSN 2227-7080 Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert
Back to Top