Next Issue
Volume 2, June
Previous Issue
Volume 1, December
 
 

Electronics, Volume 2, Issue 1 (March 2013) – 6 articles , Pages 1-112

  • Issues are regarded as officially published after their release is announced to the table of contents alert mailing list.
  • You may sign up for e-mail alerts to receive table of contents of newly released issues.
  • PDF is the official format for papers published in both, html and pdf forms. To view the papers in pdf format, click on the "PDF Full-text" link, and use the free Adobe Reader to open them.
Order results
Result details
Section
Select all
Export citation of selected articles as:
521 KiB  
Article
Analysis and Design of a Higher Current ZVS-PWM Converter for Industrial Applications
by Navid Golbon and Gerry Moschopoulos
Electronics 2013, 2(1), 94-112; https://doi.org/10.3390/electronics2010094 - 08 Mar 2013
Cited by 2 | Viewed by 7257
Abstract
A new auxiliary circuit that can be implemented in DC-DC and AC-DC ZVS-PWM converters is proposed in the paper. The circuit is for ZVS-PWM converters used in applications where high-frequency operation is needed and the load current is higher than that of typical [...] Read more.
A new auxiliary circuit that can be implemented in DC-DC and AC-DC ZVS-PWM converters is proposed in the paper. The circuit is for ZVS-PWM converters used in applications where high-frequency operation is needed and the load current is higher than that of typical ZVS-PWM converters. In the paper, the operation of a new ZVS-PWM converter is described, its steady-state operation is analyzed, and a procedure for its design is derived and then demonstrated. The feasibility of the new converter is confirmed by experimental results obtained from a prototype. Full article
Show Figures

Figure 1

843 KiB  
Article
Far Field Extrapolation from Near Field Interactions and Shielding Influence Investigations Based on a FE-PEEC Coupling Method
by Edith Clavel, Thanh-Son Tran, Jérémie Aimé, Gérard Meunier and James Roudet
Electronics 2013, 2(1), 80-93; https://doi.org/10.3390/electronics2010080 - 08 Mar 2013
Cited by 2 | Viewed by 6972
Abstract
Regarding standards, it is well established that common mode currents are the main source of far field emitted by variable frequency drive (VFD)-cable-motor associations. These currents are generated by the combination of floating potentials with stray capacitances between these floating potential tracks and [...] Read more.
Regarding standards, it is well established that common mode currents are the main source of far field emitted by variable frequency drive (VFD)-cable-motor associations. These currents are generated by the combination of floating potentials with stray capacitances between these floating potential tracks and the mechanical parts connected to the earth (the heatsink or cables are usual examples). Nowadays, due to frequency and power increases, the systematic compliance to EMC (ElectroMagnetic Compatibility) becomes increasingly difficult and costly for industrials. As a consequence, there is a well-identified need to investigate practical and low cost solutions to reduce the radiated fields of VFD-cable-motor associations. A well-adapted solution is the shielding of wound components well known as the major source of near magnetic field. However, this solution is not convenient, it is expensive and may not be efficient regarding far field reduction. Optimizing the components placement could be a better and cheaper solution. As a consequence, dedicated tools have to be developed to efficiently investigate not easy comprehendible phenomena and finally to control EMC disturbances using component placement, layout geometry, shielding design if needed. However, none of the modeling methods usually used in industry complies with large frequency range and far field models including magnetic materials, multilayer PCBs, and shielding. The contribution of this paper is to show that alternatives regarding modeling solutions exist and can be used to get in-deep analysis of such complex structures. It is shown in this paper that near field investigations can give information on far field behavior. It is illustrated by an investigation of near field interactions and shielding influence using a FE-PEEC hybrid method. The test case combining a common mode filter with the floating potentials tracks of an inverter is based on an industrial and commercialized VFD. The near field interactions between the common mode inductance and the tracks with floating potentials are revealed. Then, the influence of the common mode inductance shielding is analyzed. Full article
Show Figures

Figure 1

402 KiB  
Article
Design of a Parallel Sampling Encoder for Analog to Information (A2I) Converters: Theory, Architecture and CMOS Implementation
by Thomas S. Murray, Philippe O. Pouliquen and Andreas G. Andreou
Electronics 2013, 2(1), 57-79; https://doi.org/10.3390/electronics2010057 - 05 Mar 2013
Cited by 4 | Viewed by 5522
Abstract
We discuss the architecture and design of parallel sampling front ends for analog to information (A2I) converters. As a way of example, we detail the design of a custom 0.5 µm CMOS implementation of a mixed signal parallel sampling encoder architecture. The system [...] Read more.
We discuss the architecture and design of parallel sampling front ends for analog to information (A2I) converters. As a way of example, we detail the design of a custom 0.5 µm CMOS implementation of a mixed signal parallel sampling encoder architecture. The system consists of configurable parallel analog processing channels, whose output is sampled by traditional analog-to-digital converters (ADCs). The analog front-end modulates the signal of interest with a high-speed digital chipping sequence and integrates the result prior to sampling at a low rate. An FPGA is employed to generate the chipping sequences and process the digitized samples. Full article
Show Figures

Graphical abstract

452 KiB  
Technical Note
Fault Tree Analysis for Safety/Security Verification in Aviation Software
by Andrew J. Kornecki and Mingye Liu
Electronics 2013, 2(1), 41-56; https://doi.org/10.3390/electronics2010041 - 31 Jan 2013
Cited by 38 | Viewed by 14564
Abstract
The Next Generation Air Traffic Management system (NextGen) is a blueprint of the future National Airspace System. Supporting NextGen is a nation-wide Aviation Simulation Network (ASN), which allows integration of a variety of real-time simulations to facilitate development and validation of the NextGen [...] Read more.
The Next Generation Air Traffic Management system (NextGen) is a blueprint of the future National Airspace System. Supporting NextGen is a nation-wide Aviation Simulation Network (ASN), which allows integration of a variety of real-time simulations to facilitate development and validation of the NextGen software by simulating a wide range of operational scenarios. The ASN system is an environment, including both simulated and human-in-the-loop real-life components (pilots and air traffic controllers). Real Time Distributed Simulation (RTDS) developed at Embry Riddle Aeronautical University, a suite of applications providing low and medium fidelity en-route simulation capabilities, is one of the simulations contributing to the ASN. To support the interconnectivity with the ASN, we designed and implemented a dedicated gateway acting as an intermediary, providing logic for two-way communication and transfer messages between RTDS and ASN and storage for the exchanged data. It has been necessary to develop and analyze safety/security requirements for the gateway software based on analysis of system assets, hazards, threats and attacks related to ultimate real-life future implementation. Due to the nature of the system, the focus was placed on communication security and the related safety of the impacted aircraft in the simulation scenario. To support development of safety/security requirements, a well-established fault tree analysis technique was used. This fault tree model-based analysis, supported by a commercial tool, was a foundation to propose mitigations assuring the gateway system safety and security. Full article
Show Figures

Figure 1

129 KiB  
New Book Received
Handbook of RF, Microwave, and Millimeter-Wave Components. Edited by Leonid A. Belov, Sergey M. Smolskiy and Victor N. Kochemasov, Artech House, 2012; 504 pages. Price: £119.00, ISBN 978-1-60807-209-5
by Shu-Kun Lin
Electronics 2013, 2(1), 35-40; https://doi.org/10.3390/electronics2010035 - 14 Jan 2013
Cited by 1 | Viewed by 6012
Abstract
This unique and comprehensive resource offers you a detailed treatment of the operations principles, key parameters, and specific characteristics of active and passive RF, microwave, and millimeter-wave components. The book covers both linear and nonlinear components that are used in a wide range [...] Read more.
This unique and comprehensive resource offers you a detailed treatment of the operations principles, key parameters, and specific characteristics of active and passive RF, microwave, and millimeter-wave components. The book covers both linear and nonlinear components that are used in a wide range of application areas, from communications and information sciences, to avionics, space, and military engineering. Full article
3466 KiB  
Review
Implantable Devices: Issues and Challenges
by Kateryna Bazaka and Mohan V. Jacob
Electronics 2013, 2(1), 1-34; https://doi.org/10.3390/electronics2010001 - 21 Dec 2012
Cited by 199 | Viewed by 28041
Abstract
Ageing population and a multitude of neurological and cardiovascular illnesses that cannot be mitigated by medication alone have resulted in a significant growth in the number of patients that require implantable electronic devices. These range from sensors, gastric and cardiac pacemakers, cardioverter defibrillators, [...] Read more.
Ageing population and a multitude of neurological and cardiovascular illnesses that cannot be mitigated by medication alone have resulted in a significant growth in the number of patients that require implantable electronic devices. These range from sensors, gastric and cardiac pacemakers, cardioverter defibrillators, to deep brain, nerve, and bone stimulators. Long-term implants present specific engineering challenges, including low energy consumption and stable performance. Resorbable electronics may offer excellent short-term performance without the need for surgical removal. However, most electronic materials have poor bio- and cytocompatibility, resulting in immune reactions and infections. This paper reviews the current situation and highlights challenges for future advancements. Full article
Show Figures

Figure 1

Previous Issue
Next Issue
Back to TopTop