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Coatings 2014, 4(3), 574-586; doi:10.3390/coatings4030574

Metallization on FDM Parts Using the Chemical Deposition Technique

Manufacturing Engineering, National Institute of Foundry and Forge Technology, Ranchi 834003, India
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Received: 7 May 2014 / Revised: 14 July 2014 / Accepted: 21 July 2014 / Published: 5 August 2014
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Abstract

Metallization of ABS (acrylonitrile-butadiene-styrene) parts has been studied on flat part surfaces. These parts are fabricated on an FDM (fused deposition modeling machine) using the layer-wise deposition principle using ABS as a part material. Electroless copper deposition on ABS parts was performed using two different surface preparation processes, namely ABS parts prepared using chromic acid for etching and ABS parts prepared using a solution mixture of sulphuric acid and hydrogen peroxide (H2SO4/H2O2) for etching. After surface preparations using these routes, copper (Cu) is deposited electrolessly using four different acidic baths. The acidic baths used are 5 wt% CuSO4 (copper sulfate) with 15 wt% of individual acids, namely HF (hydrofluoric acid), H2SO4 (sulphuric acid), H3PO4 (phosphoric acid) and CH3COOH (acetic acid). Cu deposition under different acidic baths used for both the routes is presented and compared based on their electrical performance, scanning electron microscopy (SEM) and energy dispersive X-ray spectrometry (EDS). The result shows that chromic acid etched samples show better electrical performance and Cu deposition in comparison to samples etched via H2SO4/H2O2. View Full-Text
Keywords: rapid prototyping; plastic; conductivity; surface preparation/conditioning; copper deposition rapid prototyping; plastic; conductivity; surface preparation/conditioning; copper deposition
This is an open access article distributed under the Creative Commons Attribution License (CC BY 3.0).

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MDPI and ACS Style

Equbal, A.; Sood, A.K. Metallization on FDM Parts Using the Chemical Deposition Technique. Coatings 2014, 4, 574-586.

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