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Completely Analytical Tools for the Next Generation of Surface and Coating Optimization
AbstractUsually, some severe efforts are required to obtain tribological parameters like Archard’s wear depth parameter kd. Complex tribological experiments have to be performed and analyzed. The paper features an approach where such parameters are extracted from effective interaction potentials in combination with more physical-oriented measurements, such as Nanoindentation and physical scratch. Thereby, the effective potentials are built up and fed from such tests. By using effective material potentials one can derive critical loading situations leading to failure (decomposition strength) for any contact situation. A subsequent connection of these decomposition or failure states with the corresponding stress or strain distributions allows the development of rather comprehensive tribological parameter models, applicable in wear and fatigue simulations, as demonstrated in this work. From this, a new relatively general wear model has been developed on the basis of the effective indenter concept by using the extended Hertzian approach for a great variety of loading situations. The models do not only allow to analyze certain tribological experiments, such as the well known pin-on disk test or the more recently developed nano-fretting test, but also to forward simulate such tests and even give hints for structured optimization or result in better component life-time prediction. The work will show how the procedure has to be applied in general and a small selection of practical examples will be presented.
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Schwarzer, N. Completely Analytical Tools for the Next Generation of Surface and Coating Optimization. Coatings 2014, 4, 253-281.View more citation formats
Schwarzer N. Completely Analytical Tools for the Next Generation of Surface and Coating Optimization. Coatings. 2014; 4(2):253-281.Chicago/Turabian Style
Schwarzer, Norbert. 2014. "Completely Analytical Tools for the Next Generation of Surface and Coating Optimization." Coatings 4, no. 2: 253-281.