Selective Plasma Etching of Polymeric Substrates for Advanced Applications
AbstractIn today’s nanoworld, there is a strong need to manipulate and process materials on an atom-by-atom scale with new tools such as reactive plasma, which in some states enables high selectivity of interaction between plasma species and materials. These interactions first involve preferential interactions with precise bonds in materials and later cause etching. This typically occurs based on material stability, which leads to preferential etching of one material over other. This process is especially interesting for polymeric substrates with increasing complexity and a “zoo” of bonds, which are used in numerous applications. In this comprehensive summary, we encompass the complete selective etching of polymers and polymer matrix micro-/nanocomposites with plasma and unravel the mechanisms behind the scenes, which ultimately leads to the enhancement of surface properties and device performance. View Full-Text
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Puliyalil, H.; Cvelbar, U. Selective Plasma Etching of Polymeric Substrates for Advanced Applications. Nanomaterials 2016, 6, 108.
Puliyalil H, Cvelbar U. Selective Plasma Etching of Polymeric Substrates for Advanced Applications. Nanomaterials. 2016; 6(6):108.Chicago/Turabian Style
Puliyalil, Harinarayanan; Cvelbar, Uroš. 2016. "Selective Plasma Etching of Polymeric Substrates for Advanced Applications." Nanomaterials 6, no. 6: 108.