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Appl. Sci. 2016, 6(6), 179; doi:10.3390/app6060179

Output Properties of Transparent Submount Packaged FlipChip Light-Emitting Diode Modules

1
Department of Electronic Engineering, Chang Gung University, Kweishan, Taoyuan 333, Taiwan
2
Department of Urology, Chang Gung Memorial Hospital, Kweishan, Taoyuan 333, Taiwan
3
Department of Mechanical Engineering, Ming Chi University of Technology, 84 Gungjuan Rd., Taishan Dist., New Taipei City 24301, Taiwan
4
Department of Materials Engineering, Ming Chi University of Technology, Taishan, New Taipei City 243, Taiwan
5
Department of Nephrology, Chang Gung Memorial Hospital, Kweishan, Taoyuan 333, Taiwan
6
Department of Otolaryngology, Head and Neck Surgery, Chang Gung Memorial Hospital, Kweishan, Taoyuan 333, Taiwan
*
Author to whom correspondence should be addressed.
Academic Editor: Teen-Hang Meen
Received: 25 May 2016 / Revised: 7 June 2016 / Accepted: 14 June 2016 / Published: 20 June 2016
View Full-Text   |   Download PDF [1229 KB, uploaded 21 June 2016]   |  

Abstract

Flip chip technology has been widely adopted in modern power light-emitting diode (LED) fabrications and its output efficiency is closely related to the submount material properties. Here, we present the electrical, optical and thermal properties of flip chip light-emitting diodes mounted on transparent sapphire and borosilicate glass which have shown a higher output luminous flux when compared to the traditional non-transparent mounted LEDs. Exhibiting both better thermal conductivity and good optical transparency, flip chip LEDs with a sapphire submount showed superior performance when compared to the non-transparent silicon submount ones, and also showed better optical performance than the flip chip LEDs mounted on transparent but poor-thermal-conducting glass substrates. The correspondent analysis was carried out using ANSYS 14 to compare the experimental thermal imaging with the simulation results. TracePro software was also used to check the output luminous flux dependency on different LED mounting designs. View Full-Text
Keywords: flip chip; light emitting diode; transparent submount; light extraction flip chip; light emitting diode; transparent submount; light extraction
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Singh, P.; Yeh, D.-H.; Tan, C.-M.; Lai, C.-S.; Hou, C.-T.; Chao, T.-Y.; Chang, L.-B. Output Properties of Transparent Submount Packaged FlipChip Light-Emitting Diode Modules. Appl. Sci. 2016, 6, 179.

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