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Metals 2016, 6(12), 311; doi:10.3390/met6120311

Effect of Remelting Duration on Microstructure and Properties of SiCp/Al Composite Fabricated by Powder-Thixoforming for Electronic Packaging

State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, Lanzhou University of Technology, Lanzhou 730050, China
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Academic Editor: Hugo F. Lopez
Received: 30 August 2016 / Revised: 28 November 2016 / Accepted: 2 December 2016 / Published: 8 December 2016
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Abstract

In this work, a novel processing method called powder thixoforming was proposed to prepare composites reinforced with 50 vol % of SiC particles (SiCp) that were used for electronic packaging in order to investigate the effects of remelting duration on its microstructure and properties. Optical Microscope (OM), Scanning Electron Microscope (SEM), X-ray Diffraction (XRD) and Transmission Electron Microscope (TEM) methods were applied for the material characterization and the corresponding physical and mechanical properties were examined in detail. The obtained results indicate that the remelting duration exerted a large effect on the microstructure as well as the SiCp/Al interfacial reaction. The density and hardness of the composite continuously increased with increasing remelting duration. The thermal conductivity (TC) and bending strength (BS) first increased during the initial 90 min and then decreased. The remelting duration exerted a limited influence on the coefficient of thermal expansion (CTE). The optimal TC, BS, and hardness of these composites were up to 135.79 W/(m·K), 348.53 MPa, and 105.23 HV, respectively, and the CTE was less than 6.5 ppm/K after the composites were remelted at 600 °C for 90 min. The properties of the composites could thus be controlled to conform to the application requirements for electronic packaging materials. View Full-Text
Keywords: particle-reinforced composites; powder thixoforming; microstructure; thermo-physical properties; mechanical properties particle-reinforced composites; powder thixoforming; microstructure; thermo-physical properties; mechanical properties
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Cai, S.; Chen, T.; Zhang, X. Effect of Remelting Duration on Microstructure and Properties of SiCp/Al Composite Fabricated by Powder-Thixoforming for Electronic Packaging. Metals 2016, 6, 311.

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