Open AccessThis article is
- freely available
Twinning Phenomena along and beyond the Bain Path
IFW Dresden, P.O. Box 270116, 01171 Dresden, Germany
TU Dresden, Institute of Materials Science, 01062 Dresden, Germany
TU Chemnitz, Institute of Physics, 09107 Chemnitz, Germany
TU Bergakademie Freiberg, Institute of Materials Science, 09596 Freiberg, Germany
* Author to whom correspondence should be addressed.
Received: 24 July 2013; in revised form: 11 September 2013 / Accepted: 26 September 2013 / Published: 9 October 2013
Abstract: Twinning is a phenomenon that occurs, e.g., during deformation, martensitic transformation and film growth. The present study shows that the crystallography of twinning can be described by two twinning modes along the complete Bain transformation path and beyond connecting body-centered and face-centered cubic structures. To probe this concept, we used strained epitaxial films of the Fe-Pd magnetic shape memory system. As the substrate acts as an absolute reference frame, we could show by pole figure measurements that all observed twinning can be a body-centered and face-centered cubic twinning mode. This continuously transforms towards identity when approaching the complementary structure.
Keywords: deformation twinning; transformation twinning; adaptive twinning; magnetic shape memory; Fe-Pd
Article StatisticsClick here to load and display the download statistics.
Notes: Multiple requests from the same IP address are counted as one view.
Cite This Article
MDPI and ACS Style
Kauffmann-Weiss, S.; Kauffmann, A.; Niemann, R.; Freudenberger, J.; Schultz, L.; Fähler, S. Twinning Phenomena along and beyond the Bain Path. Metals 2013, 3, 319-336.
Kauffmann-Weiss S, Kauffmann A, Niemann R, Freudenberger J, Schultz L, Fähler S. Twinning Phenomena along and beyond the Bain Path. Metals. 2013; 3(4):319-336.
Kauffmann-Weiss, Sandra; Kauffmann, Alexander; Niemann, Robert; Freudenberger, Jens; Schultz, Ludwig; Fähler, Sebastian. 2013. "Twinning Phenomena along and beyond the Bain Path." Metals 3, no. 4: 319-336.