Next Article in Journal
Effect of the Grafting Reaction of Aluminum Nitride on the Multi-Walled Carbon Nanotubes on the Thermal Properties of the Poly(phenylene sulfide) Composites
Next Article in Special Issue
Deformation-Induced Phase Transitions in iPP Polymorphs
Previous Article in Journal
Thermal Conductivity of Graphene-Polymer Composites: Mechanisms, Properties, and Applications
Previous Article in Special Issue
Fabrication of Multi-Layered Lidocaine and Epinephrine-Eluting PLGA/Collagen Nanofibers: In Vitro and In Vivo Study
Article Menu
Issue 9 (September) cover image

Export Article

Open AccessArticle
Polymers 2017, 9(9), 451; doi:10.3390/polym9090451

Mixed Rigid and Flexible Component Design for High-Performance Polyimide Films

Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing 100190, China
Author to whom correspondence should be addressed.
Received: 25 July 2017 / Revised: 11 September 2017 / Accepted: 14 September 2017 / Published: 15 September 2017
(This article belongs to the Special Issue Processing-Structure-Properties Relationships in Polymers)
View Full-Text   |   Download PDF [30984 KB, uploaded 18 September 2017]   |  


To develop the polyimide (PI) which is closely matched to the coefficient of the thermal expansion (CTE) of copper, a series of PIs are prepared from 5,4′-diamino-2-phenyl benzimidazole (DAPBI), 4,4′-diaminodiphenyl ether (ODA), and 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA) using a sequential copolymerization, blade coating, and thermal imidization process. The physical properties of the PIs are effectively regulated and optimized by adjusting the ratio of the rigid DAPBI and flexible ODA components. By increasing the DAPBI content, thermal stability, dimensional stability, and mechanical properties, the resultant polymer is enhanced. PI-80 exhibits an excellent comprehensive performance, a glass transition temperature of 370 °C, and a tensile strength of 210 MPa. Furthermore, the CTE as calculated in the range 50–250 °C is ca. 19 ppm/K, which is equal to that of copper. A highly dimensionally stable, curl-free, and high T-style peel strength (6.4 N/cm) of copper/PI laminate was obtained by casting the polyamic acid onto copper foil (13 μm) and thermally curing at 360 °C, which indicates that it has the potential to be applied as an electronic film for flexible displays and flexible printed circuit boards. A structural rationalization for these remarkable properties is also presented. View Full-Text
Keywords: polyimide film; linear coefficient of thermal expansion (CTE); copper clad laminate; structure and properties polyimide film; linear coefficient of thermal expansion (CTE); copper clad laminate; structure and properties

Figure 1

This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

Scifeed alert for new publications

Never miss any articles matching your research from any publisher
  • Get alerts for new papers matching your research
  • Find out the new papers from selected authors
  • Updated daily for 49'000+ journals and 6000+ publishers
  • Define your Scifeed now

SciFeed Share & Cite This Article

MDPI and ACS Style

Yu, X.; Liang, W.; Cao, J.; Wu, D. Mixed Rigid and Flexible Component Design for High-Performance Polyimide Films. Polymers 2017, 9, 451.

Show more citation formats Show less citations formats

Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Related Articles

Article Metrics

Article Access Statistics



[Return to top]
Polymers EISSN 2073-4360 Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert
Back to Top