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Polymers 2017, 9(10), 513; https://doi.org/10.3390/polym9100513

A Low-Cost, Formaldehyde-Free and High Flame Retardancy Wood Adhesive from Inorganic Adhesives: Properties and Performance

1,2,3
,
1,2,3
,
1,2,3,* and 1,2,3,*
1
Key Laboratory of Wood Materials Science and Utilization (Beijing Forestry University), Ministry of Education, Beijing 100083, China
2
Beijing Key Laboratory of Wood Science and Engineering, Beijing Forestry University, Beijing 100083, China
3
College of Materials Science and Technology, Beijing Forestry University, Beijing 100083, China
*
Authors to whom correspondence should be addressed.
Received: 13 September 2017 / Revised: 11 October 2017 / Accepted: 11 October 2017 / Published: 16 October 2017
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Abstract

Wood composites used in indoor living environments often pose formaldehyde emission and fire hazard problems. In this study, magnesium oxychloride cement-based (MOC) inorganic adhesives are presented as an effective and sustainable binder for plywood applications. The phase composition, microstructure, and thermal stability of the adhesives prepared with different ratios of MgO/MgCl2 were investigated. In addition, the dry and wet shear strength and the combustion behavior of the plywood were also examined. The results indicated that the limiting oxygen index (LOI) values of the plywood bonded by the MOC adhesives were higher than those of the plywood bonded by urea-formaldehyde resin. The active MgO/MgCl2 molar ratio of 7 was the optimal ratio for the dry and wet shear strength of the plywood with values of 1.02 and 0.88 MPa, respectively, which meet the interior use panel (Type II plywood) requirements. These improvements were ascribed to the increasing ratio of MgO/MgCl2 that facilitated the formation of an excellent microstructure. Meanwhile, the continuous hydration phase strengthened the interaction between the MOC adhesive and the wood. With these improved properties, MOC adhesive is expected to be widely used for industrial applications in plywood fabrication. View Full-Text
Keywords: plywood; inorganic adhesive; bonding strength; thermal stability; flame retardancy plywood; inorganic adhesive; bonding strength; thermal stability; flame retardancy
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).
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Jin, S.; Li, K.; Li, J.; Chen, H. A Low-Cost, Formaldehyde-Free and High Flame Retardancy Wood Adhesive from Inorganic Adhesives: Properties and Performance. Polymers 2017, 9, 513.

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