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Polymers 2016, 8(6), 215; doi:10.3390/polym8060215

High Temperature Epoxy Foam: Optimization of Process Parameters

1
Université de Toulouse, INPT, Laboratoire Génie de Production, Ecole Nationale d'Ingénieurs de Tarbes, 47 Avenue d’Azereix, B.P. 1629, 65016 Tarbes cedex, France
2
Roxel France, N151, 18570 Le Subdray, France
3
Institut Charles Gerhardt, Equipe Ingénierie et Architectures Macromoléculaires, UMR CNRS 5253, CC 1702, Université de Montpellier, Place Eugène Bataillon, 34095 Montpellier, France
*
Author to whom correspondence should be addressed.
Academic Editor: Antonio Pizzi
Received: 5 May 2016 / Revised: 26 May 2016 / Accepted: 30 May 2016 / Published: 7 June 2016

Abstract

For many years, reduction of fuel consumption has been a major aim in terms of both costs and environmental concerns. One option is to reduce the weight of fuel consumers. For this purpose, the use of a lightweight material based on rigid foams is a relevant choice. This paper deals with a new high temperature epoxy expanded material as substitution of phenolic resin, classified as potentially mutagenic by European directive Reach. The optimization of thermoset foam depends on two major parameters, the reticulation process and the expansion of the foaming agent. Controlling these two phenomena can lead to a fully expanded and cured material. The rheological behavior of epoxy resin is studied and gel time is determined at various temperatures. The expansion of foaming agent is investigated by thermomechanical analysis. Results are correlated and compared with samples foamed in the same temperature conditions. The ideal foaming/gelation temperature is then determined. The second part of this research concerns the optimization of curing cycle of a high temperature trifunctional epoxy resin. A two-step curing cycle was defined by considering the influence of different curing schedules on the glass transition temperature of the material. The final foamed material has a glass transition temperature of 270 °C. View Full-Text
Keywords: expandable microsphere; rigid foam; TETM trifunctional epoxy; thermomechanical analysis expandable microsphere; rigid foam; TETM trifunctional epoxy; thermomechanical analysis
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

El Gazzani, S.; Nassiet, V.; Habas, J.-P.; Freydier, C.; Hilleshein, A. High Temperature Epoxy Foam: Optimization of Process Parameters. Polymers 2016, 8, 215.

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