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Polymers 2018, 10(3), 277; doi:10.3390/polym10030277

Thermoconductive Thermosetting Composites Based on Boron Nitride Fillers and Thiol-Epoxy Matrices

Department of Mechanical Engineering, Universitat Rovira i Virgili, C/Av. Països Catalans, 26, 43007 Tarragona, Spain
Thermodynamics Laboratory, ETSEIB Universitat Politècnica de Catalunya, Av. Diagonal 647, 08028 Barcelona, Spain
Department of Analytical and Organic Chemistry, Universitat Rovira i Virgili, C/Marcel·lí Domingo s/n, 43007 Tarragona, Spain
Author to whom correspondence should be addressed.
Received: 6 February 2018 / Revised: 28 February 2018 / Accepted: 4 March 2018 / Published: 7 March 2018
(This article belongs to the Special Issue Hybrid Materials Based on Thermosets)
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In this work, the effect of the addition of boron nitride (BN) fillers in a thiol-cycloaliphatic epoxy formulation has been investigated. Calorimetric studies put into evidence that the kinetics of the curing has been scarcely affected and that the addition of particles does not affect the final structure of the network. Rheologic studies have shown the increase in the viscoelastic properties on adding the filler and allow the percolation threshold to be calculated, which was found to be 35.5%. The use of BN agglomerates of bigger size increases notably the viscosity of the formulation. Glass transition temperatures are not affected by the filler added, but Young’s modulus and hardness have been notably enhanced. Thermal conductivity of the composites prepared shows a linear increase with the proportion of BN particle sheets added, reaching a maximum of 0.97 W/K·m. The addition of 80 μm agglomerates, allowed to increase this value until 1.75 W/K·m. View Full-Text
Keywords: cycloaliphatic epoxy resin; composites; thermal conductivity; boron nitride; thiol-epoxy cycloaliphatic epoxy resin; composites; thermal conductivity; boron nitride; thiol-epoxy

This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Isarn, I.; Ramis, X.; Ferrando, F.; Serra, A. Thermoconductive Thermosetting Composites Based on Boron Nitride Fillers and Thiol-Epoxy Matrices. Polymers 2018, 10, 277.

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