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Crystals 2017, 7(8), 240; doi:10.3390/cryst7080240

Atomistic Insights into the Effects of Residual Stress during Nanoindentation

1
State Key Laboratory for Mechanical Behavior of Materials, Xi’an Jiaotong University, Xi’an 710049, China
2
S&V Laboratory, Department of Engineering Mechanics, Xi’an Jiaotong University, Xi’an 710049, China
*
Author to whom correspondence should be addressed.
Received: 21 June 2017 / Revised: 26 July 2017 / Accepted: 30 July 2017 / Published: 1 August 2017
(This article belongs to the Special Issue Crystal Indentation Hardness)
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Abstract

The influence of in-plane residual stress on Hertzian nanoindentation for single-crystal copper thin film is investigated using molecular dynamics simulations (MD). It is found that: (i) the yield strength of incipient plasticity increases with compressive residual stress, but decreases with tensile residual stress; (ii) the hardness decreases with tensile residual stress, and increases with compressive residual stress, but abruptly drops down at a higher compressive residual stress level, because of the deterioration of the surface; (iii) the indentation modulus reduces linearly with decreasing compressive residual stress (and with increasing tensile residual stress). It can be concluded from the MD simulations that the residual stress not only strongly influences the dislocation evolution of the plastic deformation process, but also significantly affects the size of the plastic zone. View Full-Text
Keywords: nanoindentation; residual stress; plastic deformation; molecular dynamics nanoindentation; residual stress; plastic deformation; molecular dynamics
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Sun, K.; Shi, J.; Ma, L. Atomistic Insights into the Effects of Residual Stress during Nanoindentation. Crystals 2017, 7, 240.

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