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Journal: Crystals, 2016
Volume: 6
Number: 12

Article: Formation Mechanism of Porous Cu3Sn Intermetallic Compounds by High Current Stressing at High Temperatures in Low-Bump-Height Solder Joints
Authors: by Jie-An Lin, Chung-Kuang Lin, Chen-Min Liu, Yi-Sa Huang, Chih Chen, David T. Chu and King-Ning Tu
Link: https://www.mdpi.com/2073-4352/6/1/12

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