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Micromachines 2016, 7(9), 166; doi:10.3390/mi7090166

Reliability Design and Electro-Thermal-Optical Simulation of Bridge-Style Infrared Thermal Emitters

1
Pen-Tung Sah Institute of Micro-Nano Science and Technology, Xiamen University, Xiamen 361005, China
2
Department of Micro and Nano Systems Technology, Buskerud and Vestfold University College, Horten 3184, Norway
*
Author to whom correspondence should be addressed.
Academic Editor: Ha Duong Ngo
Received: 7 July 2016 / Revised: 1 September 2016 / Accepted: 5 September 2016 / Published: 13 September 2016
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Abstract

Designs and simulations of silicon-based micro-electromechanical systems (MEMS) infrared (IR) thermal emitters for gas sensing application are presented. The IR thermal emitter is designed as a bridge-style hotplate (BSH) structure suspended on a silicon frame for realizing a good thermal isolation between hotplate and frame. For investigating the reliability of BSH structure, three kinds of fillet structures were designed in the contact corner between hotplate and frame. A 3-dimensional finite element method (3D-FEM) is used to investigate the electro-thermal, thermal-mechanical, and thermal-optical properties of BSH IR emitter using software COMSOLTM (COMSOL 4.3b, COMSOL Inc., Stockholm, Sweden). The simulation results show that the BSH with oval fillet has the lowest stress distribution and smoothest flows of stress streamlines, while the BSH with square fillet has the highest temperature and stress distribution. The thermal-optical and thermal-response simulations further indicate that the BSH with oval fillet is the optimal design for a reliable IR thermal emitter in spite of having slight inadequacies in emission intensity and modulation bandwidth in comparison with other two structures. View Full-Text
Keywords: thermal emitter; infrared emission; finite element method; micro-electromechanical systems thermal emitter; infrared emission; finite element method; micro-electromechanical systems
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Zhou, P.; Chen, R.; Wang, N.; San, H.; Chen, X. Reliability Design and Electro-Thermal-Optical Simulation of Bridge-Style Infrared Thermal Emitters. Micromachines 2016, 7, 166.

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