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Micromachines 2016, 7(5), 76; doi:10.3390/mi7050076

Fabrication of Vacuum-Sealed Capacitive Micromachined Ultrasonic Transducer Arrays Using Glass Reflow Process

1
Microsystem Integration Center (μSIC), Tohoku University, Sendai 980-8579, Japan
2
Department of Electronic Engineering, Hanyang University, Seoul 04763, Korea
3
Graduate School of Engineering, Tohoku University, Sendai 980-8579, Japan
*
Author to whom correspondence should be addressed.
Academic Editor: Rolf Wuthrich
Received: 26 February 2016 / Revised: 6 April 2016 / Accepted: 19 April 2016 / Published: 25 April 2016
(This article belongs to the Special Issue Glass Micromachining)
View Full-Text   |   Download PDF [2207 KB, uploaded 25 April 2016]   |  

Abstract

This paper presents a process for the fabrication of vacuum-sealed capacitive micromachined ultrasonic transducer (CMUT) arrays using glass reflow and anodic bonding techniques. Silicon through-wafer interconnects have been investigated by the glass reflow process. Then, the patterned silicon-glass reflow wafer is anodically bonded to an SOI (silicon-on-insulator) wafer for the fabrication of CMUT devices. The CMUT 5 × 5 array has been successfully fabricated. The resonant frequency of the CMUT array with a one-cell radius of 100 µm and sensing gap of 3.2 µm (distance between top and bottom electrodes) is observed at 2.84 MHz. The Q factor is approximately 1300 at pressure of 0.01 Pa. View Full-Text
Keywords: capacitive micromachined ultrasonic transducer; glass reflow process; anodic bonding; medical imaging; non-destructive measurement; chemical sensing capacitive micromachined ultrasonic transducer; glass reflow process; anodic bonding; medical imaging; non-destructive measurement; chemical sensing
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Toan, N.V.; Hahng, S.; Song, Y.; Ono, T. Fabrication of Vacuum-Sealed Capacitive Micromachined Ultrasonic Transducer Arrays Using Glass Reflow Process. Micromachines 2016, 7, 76.

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