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Micromachines 2016, 7(4), 54; doi:10.3390/mi7040054

Surface Tension Directed Fluidic Self-Assembly of Semiconductor Chips across Length Scales and Material Boundaries

Fachgebiet Nanotechnologie, Technische Universität Ilmenau, Gustav-Kirchhoff-Strasse 1, D-98693 Ilmenau, Germany
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Academic Editor: Massimo Mastrangeli
Received: 16 January 2016 / Revised: 22 March 2016 / Accepted: 23 March 2016 / Published: 28 March 2016
(This article belongs to the Special Issue Building by Self-Assembly)
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Abstract

This publication provides an overview and discusses some challenges of surface tension directed fluidic self-assembly of semiconductor chips which are transported in a liquid medium. The discussion is limited to surface tension directed self-assembly where the capture, alignment, and electrical connection process is driven by the surface free energy of molten solder bumps where the authors have made a contribution. The general context is to develop a massively parallel and scalable assembly process to overcome some of the limitations of current robotic pick and place and serial wire bonding concepts. The following parts will be discussed: (2) Single-step assembly of LED arrays containing a repetition of a single component type; (3) Multi-step assembly of more than one component type adding a sequence and geometrical shape confinement to the basic concept to build more complex structures; demonstrators contain (3.1) self-packaging surface mount devices, and (3.2) multi-chip assemblies with unique angular orientation. Subsequently, measures are discussed (4) to enable the assembly of microscopic chips (10 μm–1 mm); a different transport method is introduced; demonstrators include the assembly of photovoltaic modules containing microscopic silicon tiles. Finally, (5) the extension to enable large area assembly is presented; a first reel-to-reel assembly machine is realized; the machine is applied to the field of solid state lighting and the emerging field of stretchable electronics which requires the assembly and electrical connection of semiconductor devices over exceedingly large area substrates. View Full-Text
Keywords: fluidic self assembly; macroelectronics; printable electronics fluidic self assembly; macroelectronics; printable electronics
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Biswas, S.; Mozafari, M.; Stauden, T.; Jacobs, H.O. Surface Tension Directed Fluidic Self-Assembly of Semiconductor Chips across Length Scales and Material Boundaries. Micromachines 2016, 7, 54.

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