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Micromachines 2016, 7(11), 211; doi:10.3390/mi7110211

An Interference-Assisted Thermal Bonding Method for the Fabrication of Thermoplastic Microfluidic Devices

School of Mechanical Engineering, Yeungnam University, Daehakro 280, Gyeongsan, 38541 Gyeongbuk, Korea
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Academic Editors: Weihua Li, Hengdong Xi and Say Hwa Tan
Received: 20 September 2016 / Revised: 8 November 2016 / Accepted: 17 November 2016 / Published: 22 November 2016
(This article belongs to the Special Issue Insights and Advancements in Microfluidics)
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Abstract

Solutions for the bonding and sealing of micro-channels in the manufacturing process of microfluidic devices are limited; therefore, further technical developments are required to determine these solutions. In this study, a new bonding method for thermoplastic microfluidic devices was developed by combining an interference fit with a thermal treatment at low pressure. This involved a process of first injection molding thermoplastic substrates with a microchannel structure, and then performing bonding experiments at different bonding conditions. The results indicated the successful bonding of microchannels over a wide range of bonding pressures with the help of the interference fit. The study also determined additional advantages of the proposed bonding method by comparing the method with the conventional thermal bonding method. View Full-Text
Keywords: lab-on-a-chip; thermal bonding; interference fit; injection molding lab-on-a-chip; thermal bonding; interference fit; injection molding
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MDPI and ACS Style

Gong, Y.; Park, J.M.; Lim, J. An Interference-Assisted Thermal Bonding Method for the Fabrication of Thermoplastic Microfluidic Devices. Micromachines 2016, 7, 211.

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