Micromachines 2011, 2(2), 157-166; doi:10.3390/mi2020157
Article

Ultrasonic Hot Embossing

RWTH Aachen University, Konstruktion und Entwicklung von Mikrosystemen (KEmikro), Steinbachstraße 53 B, 52074 Aachen, Germany
* Author to whom correspondence should be addressed.
Received: 31 March 2011; in revised form: 3 May 2011 / Accepted: 9 May 2011 / Published: 11 May 2011
(This article belongs to the Special Issue Polymer MEMS)
PDF Full-text Download PDF Full-Text [282 KB, uploaded 11 May 2011 13:16 CEST]
Abstract: Ultrasonic hot embossing is a new process for fast and low-cost production of micro systems from polymer. Investment costs are on the order of 20.000 € and cycle times are a few seconds. Microstructures are fabricated on polymer foils and can be combined to three-dimensional systems by ultrasonic welding.
Keywords: ultrasound; hot embossing; polymer; micro system; ultrasonic hot embossing

Article Statistics

Load and display the download statistics.

Citations to this Article

Cite This Article

MDPI and ACS Style

Schomburg, W.K.; Burlage, K.; Gerhardy, C. Ultrasonic Hot Embossing. Micromachines 2011, 2, 157-166.

AMA Style

Schomburg WK, Burlage K, Gerhardy C. Ultrasonic Hot Embossing. Micromachines. 2011; 2(2):157-166.

Chicago/Turabian Style

Schomburg, Werner Karl; Burlage, Katharina; Gerhardy, Christof. 2011. "Ultrasonic Hot Embossing." Micromachines 2, no. 2: 157-166.

Micromachines EISSN 2072-666X Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert