Next Article in Journal
Effect of the Detector Width and Gas Pressure on the Frequency Response of a Micromachined Thermal Accelerometer
Next Article in Special Issue
Liquid Encapsulation in Parylene Microstructures Using Integrated Annular-Plate Stiction Valves
Previous Article in Journal
Focusing Light with Curved Guided-Mode Resonance Reflectors
Micromachines 2011, 2(2), 157-166; doi:10.3390/mi2020157

Ultrasonic Hot Embossing

* ,
Received: 31 March 2011 / Revised: 3 May 2011 / Accepted: 9 May 2011 / Published: 11 May 2011
(This article belongs to the Special Issue Polymer MEMS)
View Full-Text   |   Download PDF [282 KB, uploaded 11 May 2011]   |   Browse Figures
Abstract: Ultrasonic hot embossing is a new process for fast and low-cost production of micro systems from polymer. Investment costs are on the order of 20.000 € and cycle times are a few seconds. Microstructures are fabricated on polymer foils and can be combined to three-dimensional systems by ultrasonic welding.
Keywords: ultrasound; hot embossing; polymer; micro system; ultrasonic hot embossing ultrasound; hot embossing; polymer; micro system; ultrasonic hot embossing
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Export to BibTeX |

MDPI and ACS Style

Schomburg, W.K.; Burlage, K.; Gerhardy, C. Ultrasonic Hot Embossing. Micromachines 2011, 2, 157-166.

AMA Style

Schomburg WK, Burlage K, Gerhardy C. Ultrasonic Hot Embossing. Micromachines. 2011; 2(2):157-166.

Chicago/Turabian Style

Schomburg, Werner Karl; Burlage, Katharina; Gerhardy, Christof. 2011. "Ultrasonic Hot Embossing." Micromachines 2, no. 2: 157-166.

Micromachines EISSN 2072-666X Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert