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Micromachines 2011, 2(2), 157-166; doi:10.3390/mi2020157

Ultrasonic Hot Embossing

RWTH Aachen University, Konstruktion und Entwicklung von Mikrosystemen (KEmikro), Steinbachstraße 53 B, 52074 Aachen, Germany
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Received: 31 March 2011 / Revised: 3 May 2011 / Accepted: 9 May 2011 / Published: 11 May 2011
(This article belongs to the Special Issue Polymer MEMS)
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Abstract

Ultrasonic hot embossing is a new process for fast and low-cost production of micro systems from polymer. Investment costs are on the order of 20.000 € and cycle times are a few seconds. Microstructures are fabricated on polymer foils and can be combined to three-dimensional systems by ultrasonic welding.
Keywords: ultrasound; hot embossing; polymer; micro system; ultrasonic hot embossing ultrasound; hot embossing; polymer; micro system; ultrasonic hot embossing
This is an open access article distributed under the Creative Commons Attribution License (CC BY 3.0).

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MDPI and ACS Style

Schomburg, W.K.; Burlage, K.; Gerhardy, C. Ultrasonic Hot Embossing. Micromachines 2011, 2, 157-166.

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