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Ultrasonic Hot Embossing
RWTH Aachen University, Konstruktion und Entwicklung von Mikrosystemen (KEmikro), Steinbachstraße 53 B, 52074 Aachen, Germany
* Author to whom correspondence should be addressed.
Received: 31 March 2011; in revised form: 3 May 2011 / Accepted: 9 May 2011 / Published: 11 May 2011
Abstract: Ultrasonic hot embossing is a new process for fast and low-cost production of micro systems from polymer. Investment costs are on the order of 20.000 € and cycle times are a few seconds. Microstructures are fabricated on polymer foils and can be combined to three-dimensional systems by ultrasonic welding.
Keywords: ultrasound; hot embossing; polymer; micro system; ultrasonic hot embossing
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Cite This Article
MDPI and ACS Style
Schomburg, W.K.; Burlage, K.; Gerhardy, C. Ultrasonic Hot Embossing. Micromachines 2011, 2, 157-166.
Schomburg WK, Burlage K, Gerhardy C. Ultrasonic Hot Embossing. Micromachines. 2011; 2(2):157-166.
Schomburg, Werner Karl; Burlage, Katharina; Gerhardy, Christof. 2011. "Ultrasonic Hot Embossing." Micromachines 2, no. 2: 157-166.