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Micromachines 2011, 2(2), 157-166; doi:10.3390/mi2020157
Article

Ultrasonic Hot Embossing

* ,
 and
RWTH Aachen University, Konstruktion und Entwicklung von Mikrosystemen (KEmikro), Steinbachstraße 53 B, 52074 Aachen, Germany
* Author to whom correspondence should be addressed.
Received: 31 March 2011 / Revised: 3 May 2011 / Accepted: 9 May 2011 / Published: 11 May 2011
(This article belongs to the Special Issue Polymer MEMS)
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Abstract

Ultrasonic hot embossing is a new process for fast and low-cost production of micro systems from polymer. Investment costs are on the order of 20.000 € and cycle times are a few seconds. Microstructures are fabricated on polymer foils and can be combined to three-dimensional systems by ultrasonic welding.
Keywords: ultrasound; hot embossing; polymer; micro system; ultrasonic hot embossing ultrasound; hot embossing; polymer; micro system; ultrasonic hot embossing
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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MDPI and ACS Style

Schomburg, W.K.; Burlage, K.; Gerhardy, C. Ultrasonic Hot Embossing. Micromachines 2011, 2, 157-166.

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