Journal: Micromachines, 2011
Article: Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration
Fukushima, T.; Konno, T.; Iwata, E.; Kobayashi, R.; Kojima, T.; Murugesan, M.; Bea, J.-C.; Lee, K.-W.; Tanaka, T.; Koyanagi, M.
MDPI provides high-quality reprints with convenient worldwide shipping. We deliver excellent quality printing on premium paper with high-resolution figures and the journal’s cover customized to your article. An ideal addition to your portfolio.