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Journal: Micromachines, 2011
Article: Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration
Authors: Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka and Mitsumasa Koyanagi
MDPI provides reprints in high quality with convenient shipping to destinations worldwide. The articles are printed in on premium paper with high-resolution figures. Our covers are customized to your article and designed to be complimentary to the journal. These reprints are ideal additions to your portfolio. Copy details: 135g/m2 paper, 2x stitched, full colour and glossy finish, orderable in quantities from 10 to 1000.
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