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Materials 2016, 9(10), 860; doi:10.3390/ma9100860

A Model of BGA Thermal Fatigue Life Prediction Considering Load Sequence Effects

1,2,†
,
1,†,* , 1
and
2
1
Reliability and System Engineering School, Beihang University, Haidian District, Beijing 100191, China
2
B. John Garrick Institute for the Risk Sciences, University of California, Los Angeles, CA 90095, USA
These authors contributed equally to this work.
*
Author to whom correspondence should be addressed.
Academic Editor: Yoshiharu Mutoh
Received: 20 August 2016 / Revised: 2 October 2016 / Accepted: 13 October 2016 / Published: 24 October 2016
(This article belongs to the Special Issue Fracture and Fatigue Mechanics of Materials)
View Full-Text   |   Download PDF [11960 KB, uploaded 24 October 2016]   |  

Abstract

Accurate testing history data is necessary for all fatigue life prediction approaches, but such data is always deficient especially for the microelectronic devices. Additionally, the sequence of the individual load cycle plays an important role in physical fatigue damage. However, most of the existing models based on the linear damage accumulation rule ignore the sequence effects. This paper proposes a thermal fatigue life prediction model for ball grid array (BGA) packages to take into consideration the load sequence effects. For the purpose of improving the availability and accessibility of testing data, a new failure criterion is discussed and verified by simulation and experimentation. The consequences for the fatigue underlying sequence load conditions are shown. View Full-Text
Keywords: BGA; life prediction; load sequence effects; crack growth; damage accumulation; resistance strain BGA; life prediction; load sequence effects; crack growth; damage accumulation; resistance strain
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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Hu, W.; Li, Y.; Sun, Y.; Mosleh, A. A Model of BGA Thermal Fatigue Life Prediction Considering Load Sequence Effects. Materials 2016, 9, 860.

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