Next Article in Journal
Correction: Long-Term Soft Denture Lining Materials. Materials 2014, 7(8), 5816-5842
Previous Article in Journal
Liquid- and Gas-Phase Diffusion of Ferrocene in Thin Films of Metal-Organic Frameworks
Article Menu

Export Article

Open AccessArticle
Materials 2015, 8(6), 3776-3790; doi:10.3390/ma8063776

Microstructural Study on Molten Marks of Fire-Causing Copper Wires

Department of Materials Science and Engineering, I-Shou University, No.1, Sec. 1, Syuecheng Rd., Dashu Dist., Kaohsiung City 84001, Taiwan
*
Authors to whom correspondence should be addressed.
Academic Editor: Luciano Feo
Received: 12 January 2015 / Revised: 1 June 2015 / Accepted: 15 June 2015 / Published: 22 June 2015
(This article belongs to the Section Structure Analysis and Characterization)
View Full-Text   |   Download PDF [929 KB, uploaded 22 June 2015]   |  

Abstract

Although electrical fires constitute the greatest percentage of the main causes of building fires, the critical evidence used by fire investigators to identify electrical fires is not always convincing to the general public. In this study, we scrutinized the microstructures of fire-causing copper wires and simulated the external environmental conditions required for the formation of fire-causing arc beads. Our metallographic investigation revealed that the primary thermal dendrites of copper at the fire-causing arc bead grew parallel to one another, but in the opposite direction to the heat flow. We determined the relationships of the undercooling (∆T0), the growth velocity (ν), and the primary spacing (λ) of the dendrites with respect to the electrical wire’s diameter. Accordingly, fire investigators can now identify fire-causing arc beads in terms of these metallographic characteristics, thereby providing clear scientific evidence for litigant judgments of electrical fires. View Full-Text
Keywords: copper; dendrite growth; solidification microstructure; transmission electron microscopy; fire; fire investigation; fire scene; electrical short circuit; electrical arc beads copper; dendrite growth; solidification microstructure; transmission electron microscopy; fire; fire investigation; fire scene; electrical short circuit; electrical arc beads
Figures

This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

Scifeed alert for new publications

Never miss any articles matching your research from any publisher
  • Get alerts for new papers matching your research
  • Find out the new papers from selected authors
  • Updated daily for 49'000+ journals and 6000+ publishers
  • Define your Scifeed now

SciFeed Share & Cite This Article

MDPI and ACS Style

Liu, K.-H.; Shih, Y.-H.; Chen, G.-J.; Chou, J.-M. Microstructural Study on Molten Marks of Fire-Causing Copper Wires. Materials 2015, 8, 3776-3790.

Show more citation formats Show less citations formats

Related Articles

Article Metrics

Article Access Statistics

1

Comments

[Return to top]
Materials EISSN 1996-1944 Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert
Back to Top