Copper Electrodeposition on a Magnesium Alloy (AZ80) with a U-Shaped Surface
AbstractCu electrodeposition was performed on a cylindrical AZ80 substrate with a U-shaped surface. A uniform deposition of Cu was achieved on an AZ80 electrode via galvanostatic etching, followed by Cu electrodeposition in an eco-friendly alkaline Cu plating bath. Improper wetting and lower rotational speeds of the AZ80 electrode resulted in an uneven Cu deposition at the inner upper site of the U-shaped surface during the Cu electroplating process. This wetting effect could be deduced from the variation in the anodic potential during the galvanostatic etching. The corrosion resistance of the Cu-deposited AZ80 electrode can be considerably improved after Ni electroplating. View Full-Text
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Huang, C.A.; Yeh, Y.H.; Lin, C.K.; Hsieh, C.Y. Copper Electrodeposition on a Magnesium Alloy (AZ80) with a U-Shaped Surface. Materials 2014, 7, 7366-7378.
Huang CA, Yeh YH, Lin CK, Hsieh CY. Copper Electrodeposition on a Magnesium Alloy (AZ80) with a U-Shaped Surface. Materials. 2014; 7(11):7366-7378.Chicago/Turabian Style
Huang, Ching A.; Yeh, Yu H.; Lin, Che K.; Hsieh, Chen Y. 2014. "Copper Electrodeposition on a Magnesium Alloy (AZ80) with a U-Shaped Surface." Materials 7, no. 11: 7366-7378.