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Materials 2014, 7(11), 7366-7378; doi:10.3390/ma7117366

Copper Electrodeposition on a Magnesium Alloy (AZ80) with a U-Shaped Surface

Department of Mechanical Engineering, Chang Gung University, Taoyuan 333, Taiwan
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Author to whom correspondence should be addressed.
Received: 14 May 2014 / Revised: 9 October 2014 / Accepted: 6 November 2014 / Published: 14 November 2014
(This article belongs to the Special Issue Light Alloys and Their Applications)
View Full-Text   |   Download PDF [581 KB, uploaded 14 November 2014]   |  

Abstract

Cu electrodeposition was performed on a cylindrical AZ80 substrate with a U-shaped surface. A uniform deposition of Cu was achieved on an AZ80 electrode via galvanostatic etching, followed by Cu electrodeposition in an eco-friendly alkaline Cu plating bath. Improper wetting and lower rotational speeds of the AZ80 electrode resulted in an uneven Cu deposition at the inner upper site of the U-shaped surface during the Cu electroplating process. This wetting effect could be deduced from the variation in the anodic potential during the galvanostatic etching. The corrosion resistance of the Cu-deposited AZ80 electrode can be considerably improved after Ni electroplating. View Full-Text
Keywords: metal and alloys; thin films; corrosion; electrochemical reactions metal and alloys; thin films; corrosion; electrochemical reactions
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Huang, C.A.; Yeh, Y.H.; Lin, C.K.; Hsieh, C.Y. Copper Electrodeposition on a Magnesium Alloy (AZ80) with a U-Shaped Surface. Materials 2014, 7, 7366-7378.

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