Materials 2012, 5(3), 364-376; doi:10.3390/ma5030364
Article

X-ray Photoelectron Spectroscopy (XPS) Depth Profiling for Evaluation of La2Zr2O7 Buffer Layer Capacity

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Received: 1 February 2012; Accepted: 21 February 2012 / Published: 27 February 2012
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
Abstract: Lanthanum zirconate (LZO) films from water-based precursors were deposited on Ni-5%W tape by chemical solution deposition. The buffer capacity of these layers includes the prevention of Ni oxidation of the substrate and Ni penetration towards the YBCO film which is detrimental for the superconducting properties. X-ray Photoelectron Spectroscopy depth profiling was used to study the barrier efficiency before and after an additional oxygen annealing step, which simulates the thermal treatment for YBCO thin film synthesis. Measurements revealed that the thermal treatment in presence of oxygen could severely increase Ni diffusion. Nonetheless it was shown that from the water-based precursors’ buffer layers with sufficient barrier capacity towards Ni penetration could be synthesized if the layers meet a certain critical thickness and density.
Keywords: coated conductor; chemical solution deposition; buffer layers; depth profile; X-ray photoelectron spectroscopy
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MDPI and ACS Style

Narayanan, V.; de Buysser, K.; Bruneel, E.; Driessche, I. X-ray Photoelectron Spectroscopy (XPS) Depth Profiling for Evaluation of La2Zr2O7 Buffer Layer Capacity. Materials 2012, 5, 364-376.

AMA Style

Narayanan V, de Buysser K, Bruneel E, Driessche I. X-ray Photoelectron Spectroscopy (XPS) Depth Profiling for Evaluation of La2Zr2O7 Buffer Layer Capacity. Materials. 2012; 5(3):364-376.

Chicago/Turabian Style

Narayanan, Vyshnavi; de Buysser, Klaartje; Bruneel, Els; Driessche, Isabel van. 2012. "X-ray Photoelectron Spectroscopy (XPS) Depth Profiling for Evaluation of La2Zr2O7 Buffer Layer Capacity." Materials 5, no. 3: 364-376.

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