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Nanohardness and Residual Stress in TiN Coatings
AbstractTiN films were prepared by the Cathodic arc evaporation deposition method under different negative substrate bias. AFM image analyses show that the growth mode of biased coatings changes from 3D island to lateral when the negative bias potential is increased. Nanohardness of the thin films was measured by nanoindentation, and residual stress was determined using Grazing incidence X ray diffraction. The maximum value of residual stress is reached at −100 V substrate bias coinciding with the biggest values of adhesion and nanohardness. Nanoindentation measurement proves that the force-depth curve shifts due to residual stress. The experimental results demonstrate that nanohardness is seriously affected by the residual stress.
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Hernández, L.C.; Ponce, L.; Fundora, A.; López, E.; Pérez, E. Nanohardness and Residual Stress in TiN Coatings. Materials 2011, 4, 929-940.View more citation formats
Hernández LC, Ponce L, Fundora A, López E, Pérez E. Nanohardness and Residual Stress in TiN Coatings. Materials. 2011; 4(5):929-940.Chicago/Turabian Style
Hernández, Luis Carlos; Ponce, Luis; Fundora, Abel; López, Enrique; Pérez, Eduardo. 2011. "Nanohardness and Residual Stress in TiN Coatings." Materials 4, no. 5: 929-940.
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