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Materials 2010, 3(2), 1269-1280; doi:10.3390/ma3021269
Review
Non-Traditional Aromatic Topologies and Biomimetic Assembly Motifs as Components of Functional Pi-Conjugated Oligomers
1
Department of Chemistry, Johns Hopkins University, 3400 N. Charles St., Baltimore, MD, 21218 USA
2
Department of Materials Science and Engineering, Johns Hopkins University, 3400 N. Charles St., Baltimore, MD, 21218 USA
3
Institute for NanoBioTechnology, Johns Hopkins University, 3400 N. Charles St., Baltimore, MD, 21218, USA
* Author to whom correspondence should be addressed.
Received: 6 January 2010; in revised form: 2 February 2010 / Accepted: 11 February 2010 / Published: 23 February 2010
(This article belongs to the Special Issue Conjugated Oligomers)
Abstract: This article will highlight our recent work using conjugated oligomers as precursors to electroactive polymer films and self-assembling nanomaterials. One area of investigation has focused on nonbenzenoid aromaticity in the context of charge delocalization in conjugated polymers. In these studies, polymerizable pi-conjugated units were coupled onto unusual aromatic cores such as methano[10]annulene. This article will also show how biologically-inspired assembly of molecularly well-defined oligopeptides that flank pi-conjugated oligomers has resulted in the aqueous construction of 1-dimensional nanomaterials that encourage electronic delocalization among the pi-electron systems.
Keywords: conjugated polymers; self-assembly; aromaticity
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MDPI and ACS Style
Tovar, J.D.; Diegelmann, S.R.; Peart, P.A. Non-Traditional Aromatic Topologies and Biomimetic Assembly Motifs as Components of Functional Pi-Conjugated Oligomers. Materials 2010, 3, 1269-1280.
AMA StyleTovar JD, Diegelmann SR, Peart PA. Non-Traditional Aromatic Topologies and Biomimetic Assembly Motifs as Components of Functional Pi-Conjugated Oligomers. Materials. 2010; 3(2):1269-1280.
Chicago/Turabian StyleTovar, John D.; Diegelmann, Stephen R.; Peart, Patricia A. 2010. "Non-Traditional Aromatic Topologies and Biomimetic Assembly Motifs as Components of Functional Pi-Conjugated Oligomers." Materials 3, no. 2: 1269-1280.
Materials
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