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Materials 2018, 11(7), 1198; https://doi.org/10.3390/ma11071198

Study of the Effect of Curing Residual Stress on the Bonding Strength of the Single Lap Joint Using a High-Temperature Phosphate Adhesive

1
Smart Structures and Advanced Composite Materials Lab, College of Aerospace and Civil Engineering, Harbin Engineering University, Harbin 150001, China
2
School of Materials Science and Engineering, Beijing Institute of Fashion Technology, Beijing 100029, China
3
Institute of Petrochemistry, Heilongjiang Academy of Science, Harbin 150001, China
*
Author to whom correspondence should be addressed.
Received: 23 June 2018 / Revised: 8 July 2018 / Accepted: 9 July 2018 / Published: 12 July 2018
(This article belongs to the Section Structure Analysis and Characterization)
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Abstract

High-temperature phosphate adhesives are widely used in the aerospace and nuclear power industries. However, complex residual stresses can result when the curing temperature parameters are unreasonable due to the brittleness of the adhesive. To reveal the curing temperature mechanism affecting the bonding strength of the phosphate adhesives, several curing temperature curves (CT-1~6) were designed for the single lap joint (SLJ) using phosphate adhesive. The residual stress helped to reveal the relationship between the curing temperature parameters and the bonding performance. In this process, the residual stress of the silicon carbide joint was measured using micro-Raman spectroscopy, and the tensile strength of the joint was tested. A cohesive zone model (CZM) was established with Abaqus® to verify the results, and the numerical results from the model agreed well with the experimental values. The residual stress and adhesive strength were obviously affected by curing temperature. The reasonable curing temperature curves have the benefits of reducing the residual stress and improving the bonding strength. View Full-Text
Keywords: phosphate adhesive; residual stress; bonding strength; micro-Raman spectroscopy; single lap joint; DSC-TG analysis phosphate adhesive; residual stress; bonding strength; micro-Raman spectroscopy; single lap joint; DSC-TG analysis
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).
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Ma, C.; Tian, Y.; Gong, Y.; Zhang, J.; Qi, H.; Wang, C. Study of the Effect of Curing Residual Stress on the Bonding Strength of the Single Lap Joint Using a High-Temperature Phosphate Adhesive. Materials 2018, 11, 1198.

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