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Materials 2018, 11(1), 84; doi:10.3390/ma11010084

Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging

1
Key Lab of Robot & Welding Automation of Jiangxi Province, Mechanical & Electrical Engineering School, Nanchang University, Nanchang 330031, China
2
State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China
*
Author to whom correspondence should be addressed.
Received: 29 November 2017 / Revised: 3 January 2018 / Accepted: 4 January 2018 / Published: 6 January 2018
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Abstract

In order to accelerate the growth of interfacial intermetallic compound (IMC) layers in a soldering structure, Cu/SAC305/Cu was first ultrasonically spot soldered and then subjected to isothermal aging. Relatively short vibration times, i.e., 400 ms and 800 ms, were used for the ultrasonic soldering. The isothermal aging was conducted at 150 °C for 0, 120, 240, and 360 h. The evolution of microstructure, the IMC layer growth mechanism during aging, and the shear strength of the joints after aging were systemically investigated. Results showed the following. (i) Formation of intermetallic compounds was accelerated by ultrasonic cavitation and streaming effects, the thickness of the interfacial Cu6Sn5 layer increased with aging time, and a thin Cu3Sn layer was identified after aging for 360 h. (ii) The growth of the interfacial IMC layer of the ultrasonically soldered Cu/SAC305/Cu joints followed a linear function of the square root of the aging time, revealing a diffusion-controlled mechanism. (iii) The tensile shear strength of the joint decreased to a small extent with increasing aging time, owing to the combined effects of IMC grain coarsening and the increase of the interfacial IMC. (iv) Finally, although the fracture surfaces and failure locations of the joint soldered with 400 ms and 800 ms vibration times show similar characteristics, they are influenced by the aging time. View Full-Text
Keywords: isothermal aging; intermetallic compound; ultrasonic bonding isothermal aging; intermetallic compound; ultrasonic bonding
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).

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MDPI and ACS Style

Li, Y.; Long, W.; Hu, X.; Fu, Y. Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging. Materials 2018, 11, 84.

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