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Materials 2017, 10(7), 739; doi:10.3390/ma10070739

Finite Element Analysis of Interfacial Debonding in Copper/Diamond Composites for Thermal Management Applications

1
Mechanical Engineering Department, University of Jeddah, Jeddah 21589, Saudi Arabia
2
FMSE, GIK Institute of Engineering Sciences and Technology, Topi 23640, Pakistan
3
Chemical Engineering Department, University of Jeddah, Jeddah 21589, Saudi Arabia
4
Mechanical Engineering Department, ENIT, University of Tunis El Manar, Tunis 2092, Tunisia
*
Author to whom correspondence should be addressed.
Received: 15 May 2017 / Revised: 27 June 2017 / Accepted: 27 June 2017 / Published: 2 July 2017
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Abstract

Copper/diamond (Cu/D) composites are famous in thermal management applications for their high thermal conductivity values. They, however, offer some interface related problems like high thermal boundary resistance and excessive debonding. This paper investigates interfacial debonding in Cu/D composites subjected to steady-state and transient thermal cyclic loading. A micro-scale finite element (FE) model was developed from a SEM image of the Cu/20 vol % D composite sample. Several test cases were assumed with respect to the direction of heat flow and the boundary interactions between Cu/uncoated diamonds and Cu/Cr-coated diamonds. It was observed that the debonding behavior varied as a result of the differences in the coefficients of thermal expansions (CTEs) among Cu, diamond, and Cr. Moreover, the separation of interfaces had a direct influence upon the equivalent stress state of the Cu-matrix, since diamond particles only deformed elastically. It was revealed through a fully coupled thermo-mechanical FE analysis that repeated heating and cooling cycles resulted in an extremely high stress state within the Cu-matrix along the diamond interface. Since these stresses lead to interfacial debonding, their computation through numerical means may help in determining the service life of heat sinks for a given application beforehand. View Full-Text
Keywords: finite element analysis; copper/diamond composite; interfacial debonding; thermal cyclic load; Cr-coated diamond finite element analysis; copper/diamond composite; interfacial debonding; thermal cyclic load; Cr-coated diamond
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Zain-ul-abdein, M.; Ijaz, H.; Saleem, W.; Raza, K.; Mahfouz, A.S.B.; Mabrouki, T. Finite Element Analysis of Interfacial Debonding in Copper/Diamond Composites for Thermal Management Applications. Materials 2017, 10, 739.

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